Shenzhen Jinxinyang Technology Co., Ltd. offers a full range of rigid board constructions from single/double sided upwards, but it also support laser drilled microvias, cavity boards, heavy copper up to 30 oz., via-in-pad, microwave & RF boards, up to 58 layers and more other technologies.

·High layer count multilayer rigid
·Thermal and signal integrity management solutions, employing coins and cavities
·FR4 / Polyimide / High Speed / Special Materials
·Hybrid solutions for Microwave/RF applications
·HDI Micro via– blind, buried, staggered & stacked vias
·Microvias filled by epoxy and copper capped
·Quick turn support
·Thermal management
·Heavy copper
·Controlled Impedance
·Large format PCB