Customized PCBs & Electronic Components — All in One Place
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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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SST11LF04-Q3CE | Microchip Technology | 5000 | - |
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WLAN 11A/N/AC FEM (PA+LNA+SP2T) |
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RF6555TR13 | RFMD | 5000 | - |
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RF FRONT END 2.4GHZ 3.3V 24QFN |
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SST12LF09-Q3CE | Microchip Technology | 5000 | - |
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WLAN 11B/G/N/AC FEM(PA+LNA+SP3T) |
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RF5516 | RFMD | 5000 | - |
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IC SWITCH WLAN SP2T |
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SST11CP22-GN | Microchip Technology | 5000 | - |
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IC MOD PAM WLAN 11A/N/AC 20UQFN |
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BA4425F-E2 | Rohm Semiconductor | 5000 | - |
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IC FM/TV FRONT END SOP8 TR |
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XCC3100ZG1MRTDT | Texas Instruments | 5000 | - |
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IC RF FRONT END |
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RFFM6201SQ | RFMD | 5000 | - |
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IC 2.4GHZ FRONT END MOD |
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SST11LF05-QVCE | Microchip Technology | 5000 | - |
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IC MOD FEM WLAN 11A/N/AC 16VQFN |
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RFFM6201SR | RFMD | 5000 | - |
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IC 2.4GHZ FRONT END MOD 100PC RL |
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XCC3101ZG1MRTDT | Texas Instruments | 5000 | - |
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IC RF FRONT END |
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RFFM3482ETR7 | RFMD | 5000 | - |
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IC 2.4GHZ FRONT END MOD |
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SKY65313-21 | Skyworks Solutions Inc. | 5000 | - |
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900MHZ FRONTEND MODULE |
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MCP2035-I/ST | Microchip Technology | 5000 | - |
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IC AFE TRANSPONDER 14TSSOP |
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MCP2035T-I/ST | Microchip Technology | 5000 | - |
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IC AFE TRANSPONDER 14TSSOP |
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BGM1034N7E6327XUSA1 | Infineon Technologies | 5000 | - |
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IC AMP MMIC RF 17.0DB TSNP-7 |
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BGM781N11E6327XUSA1 | Infineon Technologies | 5000 | - |
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MODULE GPS FRONT-END TSNP-11-2 |
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RFFM3482QTR7 | RFMD | 5000 | - |
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IC 2.4GHZ FRONT END MOD |
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LX5553LU | Microsemi Corporation | 5000 | - |
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WIRELESS LAN FRONT-END MODULE |
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LX5578LQ | Microsemi Corporation | 5000 | - |
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WIRELESS LAN FRONT-END MODULE |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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