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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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SL2S5402FUD,003 | NXP USA Inc. | 5000 | - |
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IC I-CODE SLI UNCASED FOIL |
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SL2S2102FTB,115 | NXP USA Inc. | 5000 | - |
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IC I-CODE SLI 3XSON |
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MF0UL2101DA8,118 | NXP USA Inc. | 5000 | - |
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IC MIFARE ULTRALIGHT EV1 PLLMC |
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ATA5575M1330-DDB | Microchip Technology | 5000 | - |
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IC RFID 128BIT 330PF DIE |
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ATA5575M2330-DDB | Microchip Technology | 5000 | - |
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IC RFID IDIC R/W 128BIT WAFER |
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ATA5575M133L-DDB | Microchip Technology | 5000 | - |
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IC RFID 64BIT EE 330PF DDB BUMP |
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ATA5575M1250-DDB | Microchip Technology | 5000 | - |
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IC RFID 128BIT EE 250PF U-ID DIE |
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ATA5575M2250-DDB | Microchip Technology | 5000 | - |
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IC RFID 128BIT 250PF ANIMAL BUMP |
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ST25TA512-AC6B5 | STMicroelectronics | 5000 | - |
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E-EPROM |
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ATA5575M1330-DBB | Microchip Technology | 5000 | - |
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IC RFID 64BIT 330PF WAFER |
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ATA5575M2330-DBB | Microchip Technology | 5000 | - |
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IC RFID IDIC R/W 128BIT WAFER |
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ATA5575M133L-DBB | Microchip Technology | 5000 | - |
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IC RFID 64BIT EE 330PF DBB BUMP |
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ATA5575M1250-DBB | Microchip Technology | 5000 | - |
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IC RFID 128BIT EE 250PF UID BUMP |
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ATA5575M2250-DBB | Microchip Technology | 5000 | - |
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IC RFID 128BIT 250PF ANIMAL BUMP |
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ATA5575M233A-DBB | Microchip Technology | 5000 | - |
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IC RFID 128BIT 330PF ANIMAL BUMP |
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SL2S2002FA8J | NXP USA Inc. | 5000 | - |
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IC I-CODE SLI PLLMC |
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SL2S5302FTBX | NXP USA Inc. | 5000 | - |
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IC I-CODE SLI 3XSON |
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ATA5577M1330C-DDB | Microchip Technology | 5000 | - |
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IC RFID R/W 125KHZ SAWN WAFER |
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MF0MOA4U10/D,118 | NXP USA Inc. | 5000 | - |
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IC MIFARE ULTRALIGHT FCP PLLMC |
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ATA5575M1330-DBQ | Microchip Technology | 5000 | - |
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IC RFID 128BIT EE 330PF UID BUMP |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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