Customized PCBs & Electronic Components — All in One Place
Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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CPV-P18/11-1S-6PD-Z | Ferroxcube | 5000 | - |
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COIL FORMER VERTICAL |
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9677282509 | Fair-Rite Products Corp. | 5000 | - |
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77 BOBBIN 3PC. ASSEMBLY |
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CLM/BPL/NW-PM50/39-C | Ferroxcube | 5000 | - |
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CLAMP, BASE PLATE, NUT, WASHER |
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CPV-P30/19-1S-6PD-Z | Ferroxcube | 5000 | - |
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COIL FORMER VERTICAL |
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9677353509 | Fair-Rite Products Corp. | 5000 | - |
Add To CartInquiry Now |
77 BOBBIN 3PC. ASSEMBLY |
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B65848S2000X000 | EPCOS - TDK Electronics | 5000 | - |
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MOUNTING ASSEMBLY EP 20 |
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9677352508 | Fair-Rite Products Corp. | 5000 | - |
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77 BOBBIN 3PC. ASSEMBLY COATED |
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B65687A1018T001 | EPCOS - TDK Electronics | 5000 | - |
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BOBBIN COIL FORMER PM 74 X 59 |
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B65840N1106T001 | EPCOS - TDK Electronics | 5000 | - |
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BOBBIN COIL FORMER EP 7 |
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9677242009 | Fair-Rite Products Corp. | 5000 | - |
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77 BOBBIN 3PC. ASSEMBLY |
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9677242008 | Fair-Rite Products Corp. | 5000 | - |
Add To CartInquiry Now |
77 BOBBIN 3PC. ASSEMBLY COATED |
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B66388B1000T001 | EPCOS - TDK Electronics | 5000 | - |
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CF-E65/32/27-1S |
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9677352509 | Fair-Rite Products Corp. | 5000 | - |
Add To CartInquiry Now |
77 BOBBIN 3PC. ASSEMBLY |
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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