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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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FIN930.055.M | Enerdoor | 5000 | - |
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COMMON INDUCTANCE 600V 55A |
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LH60060PC | Littelfuse Inc. | 5000 | - |
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FUSE BLOCK COVER ACS 60A 600V |
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4420.0175 | Schurter Inc. | 5000 | - |
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ACCY MOD RELAY TRIP 90-240VAC/DC |
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HF325JA | Siemens Industry, Inc. | 5000 | - |
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HDSS FUS 3P3W 240V 400A N12 SERI |
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3VA9143-0KB01 | Siemens Industry, Inc. | 5000 | - |
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BREAKER 3VA6 250A 3P TERM COVER |
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9-1393249-2 | TE Connectivity Potter & Brumfield Relays | 5000 | - |
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HEX NUT 0.625" |
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MSVCPM3-63-12 | Carlo Gavazzi Inc. | 5000 | - |
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FOR 3 GMS-63+ACCS (SIDE MNT AUX) |
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HF364NS | Siemens Industry, Inc. | 5000 | - |
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HDSS FUS 3P4W 600V 200A N4X |
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FIN900.080.V | Enerdoor | 5000 | - |
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COMMON INDUCTANCE 600V 80A |
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LH60030PC | Littelfuse Inc. | 5000 | - |
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FUSE BLOCK COVER ACS 30A 600V |
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4420.0189 | Schurter Inc. | 5000 | - |
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ACCY MOD RELAY TRIP 20-48VAC/DC |
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HF662J | Siemens Industry, Inc. | 5000 | - |
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HDSS FUS 6P6W 600V 60A N12 |
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3P25U3/84 | Altech Corporation | 5000 | - |
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BUSBAR3 PHASE25SQMMPIN TYPE 84 L |
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84-006 | TE Connectivity Potter & Brumfield Relays | 5000 | - |
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TOGGLE GUARD |
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MSVCPM4-54-12 | Carlo Gavazzi Inc. | 5000 | - |
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FOR 4 GMS-63 |
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HNFC367 | Siemens Industry, Inc. | 5000 | - |
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HDSS NF CSA 3P3W 600V 800A N1 |
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FIN958.090.M | Enerdoor | 5000 | - |
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DIFFERENTIAL INDUCTANCE 600V 90A |
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LH25100PC | Littelfuse Inc. | 5000 | - |
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FUSE BLOCK COVER ACS 100A 250V |
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0098.0093 | Schurter Inc. | 5000 | - |
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PLASTIC NUT M12.7 X 1.5 |
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DTNF361S | Siemens Industry, Inc. | 5000 | - |
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DTSS NF 3P3W 600V 30A N4X |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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