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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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FFA.4E.710.CNS | LEMO | 5000 | - |
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CONN COLLET SET |
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5204-0005-25 | Leader Tech Inc. | 5000 | - |
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AG FILLED SILICONE FLANGE MOUNT |
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DG12396R24/25 | TE Connectivity Deutsch Connectors | 5000 | - |
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COVER PROT |
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5204-0008-50 | Leader Tech Inc. | 5000 | - |
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AG/G FILLED SILICONE FLANGE MOUN |
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273-8506-008 | ITT Cannon, LLC | 5000 | - |
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CONN WIRE SEAL GRAY |
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FFP.3S.151.LN | LEMO | 5000 | - |
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MIDPIECE FOR FFP.3S. |
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212435-9 | TE Connectivity AMP Connectors | 5000 | - |
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CONN FERRULE DIN CPC |
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FFA.4E.711.CNS | LEMO | 5000 | - |
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CONN COLLET SET |
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D3899932F13N | Amphenol PCD | 5000 | - |
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CONN PROTECTIVE COVER 13 SILVER |
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KPT81-16-C | ITT Cannon, LLC | 5000 | - |
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CIRCULAR |
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5204-0029-25 | Leader Tech Inc. | 5000 | - |
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AG FILLED SILICONE FLANGE MOUNT |
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5204-0008-60 | Leader Tech Inc. | 5000 | - |
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NI/C FILLED SILICONE FLANGE MOUN |
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225-1011-000 | WEC | 5000 | - |
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CONN SEALING PLUG BLUE |
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FFP.3S.155.LNN | LEMO | 5000 | - |
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MIDPIECE PAIR FOR FFP.3S. |
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207445-1 | TE Connectivity AMP Connectors | 5000 | - |
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CONN SEALING COVER 17 BLACK |
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FFA.4E.712.CNS | LEMO | 5000 | - |
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CONN COLLET SET |
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MS27511Z18C | Amphenol PCD | 5000 | - |
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DUST CAP SHELL SIZE 18 RECEPTAC |
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BRE.4F.200.XAV | LEMO | 5000 | - |
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CONN BLANKING COVER |
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9-1193690-1 | TE Connectivity Aerospace, Defense and Marine | 5000 | - |
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TR08BI-TINEL-LOCK-RING |
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5204-0008-65 | Leader Tech Inc. | 5000 | - |
Add To CartInquiry Now |
AG/NI FILLED SILICONE FLANGE MOU |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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