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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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FLA.00.180.LN | LEMO | 5000 | - |
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SCREW PLUG FOR FLA.00. |
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HR30-8P-C(71) | Hirose Electric Co Ltd | 5000 | - |
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CONN COVER 8 BLACK |
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5204-0023-20 | Leader Tech Inc. | 5000 | - |
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CONN EMI GASKET 22 BEIGE |
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MDGT-26 | Souriau-Sunbank by Eaton | 5000 | - |
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GROUND TRACK-26INCH MDHC |
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JRC25RC(71) | Hirose Electric Co Ltd | 5000 | - |
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CONN COVER 25 SILVER |
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192900-0392 | ITT Cannon, LLC | 5000 | - |
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CONN DUST COVER 24 BLACK |
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5204-0016-30 | Leader Tech Inc. | 5000 | - |
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AG/CU FILLED FLOUROSILICONE FLAN |
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BHG.3K.100.NAS | LEMO | 5000 | - |
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CONN COVER SILVER |
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FLA.0S.325.CN | LEMO | 5000 | - |
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CONN INSULATOR CASING |
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HR30-6R-C(71) | Hirose Electric Co Ltd | 5000 | - |
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CONN COVER 6 BLACK |
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5204-0023-40 | Leader Tech Inc. | 5000 | - |
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CONN EMI GASKET 22 BEIGE |
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1520-10-340912-CS2359 | TE Connectivity AMP Connectors | 5000 | - |
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KIT BOOT ADAPTER |
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5204-0030-30 | Leader Tech Inc. | 5000 | - |
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AG/CU FILLED FLOUROSILICONE FLAN |
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192991-0416 | ITT Cannon, LLC | 5000 | - |
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CONN CONDUIT ADAPTER 24 BLACK |
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5204-0016-45 | Leader Tech Inc. | 5000 | - |
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AG/CU FILLED SILICONE FLANGE MOU |
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BFG.3T.100.CAS | LEMO | 5000 | - |
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CONN COVER SILVER |
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FLA.0S.727.CN | LEMO | 5000 | - |
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CONN COLLET FLA.0S. - 2.7MM DIA |
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HR30-7R-C(71) | Hirose Electric Co Ltd | 5000 | - |
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CONN COVER 7 BLACK |
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5204-0024-20 | Leader Tech Inc. | 5000 | - |
Add To CartInquiry Now |
CONN EMI GASKET 22 BEIGE |
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DM9605-27A-023 [V004] | TE Connectivity Deutsch Connectors | 5000 | - |
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DUST CAP |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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