Customized PCBs & Electronic Components — All in One Place
| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
|---|---|---|---|---|---|---|---|
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822K-DC | NorComp Inc. | 5000 | - |
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CONN DUST COVER SILVER |
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GDA.99.060.100SK | LEMO | 5000 | - |
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CONN O-RING SILICONE 6 X 1MM |
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MS27502Z23NL | Amphenol PCD | 5000 | - |
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DUST CAP SHELL SIZE 23 RECEPTAC |
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CIRBH1610GACF80 | TE Connectivity AMP Connectors | 5000 | - |
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GROMMET |
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JR25WCCA-14(71) | Hirose Electric Co Ltd | 5000 | - |
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CONN STRAIN RELIEF 25 BLACK |
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34215 | MENDA/EasyBraid | 5000 | - |
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CONN COVER 19R BLACK 1000PC |
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MS27502Z21NL | Amphenol PCD | 5000 | - |
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DUST CAP SHELL SIZE 21 RECEPTAC |
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UTL10DCG | Souriau-Sunbank by Eaton | 5000 | - |
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CONN DUST COVER 10 BLACK |
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LF10WBR-C(03) | Hirose Electric Co Ltd | 5000 | - |
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CONN COVER 10 BLACK |
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MS3181-16CA | Amphenol PCD | 5000 | - |
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26482 D/C RECP SZ 16 BLK ANOD |
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CA121003-910 | ITT Cannon, LLC | 5000 | - |
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CAB 28 CAP SKT CORD |
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JR25WCCA-16(71) | Hirose Electric Co Ltd | 5000 | - |
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CONN STRAIN RELIEF 25 BLACK |
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DSM96-19A-1E [V004] | TE Connectivity Deutsch Connectors | 5000 | - |
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DUST CAP |
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FFA.4S.710.CN | LEMO | 5000 | - |
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CONN COLLET FFA.4S. - 10.0MM DIA |
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5204-0033-30 | Leader Tech Inc. | 5000 | - |
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AG/CU FILLED FLOUROSILICONE FLAN |
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5204-0015-35 | Leader Tech Inc. | 5000 | - |
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AG FILLED FLOUROSILICONE FLANGE |
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TR16AI-TINEL-LOCK-RING | TE Connectivity Aerospace, Defense and Marine | 5000 | - |
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TR16AI-TINEL-LOCK-RING |
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075-8566-003 | ITT Cannon, LLC | 5000 | - |
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CONN FLANGE GASKET BLACK |
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RM15TR-C(71) | Hirose Electric Co Ltd | 5000 | - |
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CONN DUST COVER 15 SILVER |
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BACC10NA104 | Amphenol PCD | 5000 | - |
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P-CLAMP (BOEING SPEC) |
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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