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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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MS27502B23CL | Amphenol PCD | 5000 | - |
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CONN DUST COVER 23 OLIVE |
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MS3185-8-1 | Amphenol Industrial Operations | 5000 | - |
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CONN POTTING BOOT 8 |
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PCSNLS-N-BL-M40B | ITT Cannon, LLC | 5000 | - |
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CONN SEALING COVER BLUE |
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MDTB20-2 | Souriau-Sunbank by Eaton | 5000 | - |
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DAC 2X8 20 GA. F/BACK MO |
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5204-0019-25 | Leader Tech Inc. | 5000 | - |
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AG FILLED SILICONE FLANGE MOUNT |
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217-0607-024 | ITT Cannon, LLC | 5000 | - |
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BFR 24 HEX NUT |
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VS151204 | Radiall USA, Inc. | 5000 | - |
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CVB 042-16 F7 |
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MS27502B25CL | Amphenol PCD | 5000 | - |
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CONN DUST COVER 25 OLIVE |
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MS3185-10-1 | Amphenol Industrial Operations | 5000 | - |
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CONN POTTING BOOT 10 |
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BRF.3K.200.EAN | LEMO | 5000 | - |
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CONN BLANKING COVER BLACK |
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PCSNLS-1-BN-M40B | ITT Cannon, LLC | 5000 | - |
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CONN SEALING COVER BROWN |
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VG95234BOD16S | ITT Cannon, LLC | 5000 | - |
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CIRCULAR |
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5204-0021-25 | Leader Tech Inc. | 5000 | - |
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AG FILLED SILICONE FLANGE MOUNT |
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217-1078-001 | WEC | 5000 | - |
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PV 74 10 L J/N |
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VS412511 | Radiall USA, Inc. | 5000 | - |
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C026-40 CLOSURE PLATE |
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MS27501B17CL | Amphenol PCD | 5000 | - |
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CONN DUST COVER 17 OLIVE |
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MS3185-12-1 | Amphenol Industrial Operations | 5000 | - |
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CONN POTTING BOOT 12 |
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BRR.0S.200.PZSGY | LEMO | 5000 | - |
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CONN DUST COVER GRAY |
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PCSNLS-2-BK-M40B | ITT Cannon, LLC | 5000 | - |
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CONN SEALING COVER BLACK |
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TR10AI-TINEL-LOCK-RING | TE Connectivity Aerospace, Defense and Marine | 5000 | - |
Add To CartInquiry Now |
TR10AI-TINEL-LOCK-RING |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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