Customized PCBs & Electronic Components — All in One Place
| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
|---|---|---|---|---|---|---|---|
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FFA.1S.155.LNN | LEMO | 5000 | - |
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MIDPIECE PAIR FOR FFA.1S. |
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AN3055-14-6 | Amphenol Industrial Operations | 5000 | - |
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10-825936-142 ADP |
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GDA.99.120.150VK | LEMO | 5000 | - |
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CONN O-RING BLACK |
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103005-78 | TE Connectivity Deutsch Connectors | 5000 | - |
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CONN SNAP RING |
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97-121-410Y | WEC | 5000 | - |
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97-121-410Y |
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DCA-ACP-16-P-1 | Samtec Inc. | 5000 | - |
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CONN DUST COVER 16 BLACK/ORANGE |
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BGE.0M.200.XAZ | LEMO | 5000 | - |
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CONN BLANKING COVER |
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FLX40-020-03 | TE Connectivity Raychem Cable Protection | 5000 | - |
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CONN ALIGNMENT DISC SILVER |
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FFA.1S.717.LN | LEMO | 5000 | - |
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CONN COLLET SILVER |
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AN3055-14-6-621 | Amphenol Industrial Operations | 5000 | - |
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10-823956-142 |
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103007-78 | TE Connectivity Deutsch Connectors | 5000 | - |
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SNAP RING |
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10-195999-020 | Amphenol Industrial Operations | 5000 | - |
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PTSE 20 P/C STRAIGHT |
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GDA.99.130.150VK | LEMO | 5000 | - |
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CONN O-RING BLACK |
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DCA-ACP-12-P-1 | Samtec Inc. | 5000 | - |
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CONN DUST COVER 12 BLACK/ORANGE |
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BGF.0M.200.XAZ | LEMO | 5000 | - |
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CONN BLANKING COVER |
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248-8512-000 | ITT Cannon, LLC | 5000 | - |
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DUMMY REC. REAR PANEL MOUNT CA31 |
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FFA.1S.727.CN | LEMO | 5000 | - |
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CONN COLLET FFA.1S. - 2.7MM DIA |
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AN3055-16-4 | Amphenol Industrial Operations | 5000 | - |
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10-825936-161 |
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103008-78 | TE Connectivity Deutsch Connectors | 5000 | - |
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SNAP RING |
|
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10-070500-008 | Amphenol Industrial Operations | 5000 | - |
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ER 08 CAP |
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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