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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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FFA.4S.151.LN | LEMO | 5000 | - |
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MIDPIECE FOR FFA.4S. |
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66241-18 A | TE Connectivity Deutsch Connectors | 5000 | - |
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66241-18 A |
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351-1641-000 | ITT Cannon, LLC | 5000 | - |
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SS-3 SS-4 MOUNTING RING |
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10-195999-008 | Amphenol Industrial Operations | 5000 | - |
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PTSE 8 P/C STRAIGHT |
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0620-9-7820 | TE Connectivity Deutsch Connectors | 5000 | - |
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SPRING WAFER |
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BGE.5M.200.XAZ | LEMO | 5000 | - |
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CONN BLANKING COVER |
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9760-20-639 | Amphenol Industrial Operations | 5000 | - |
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10-824973-020 |
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435096-1 | TE Connectivity AMP Connectors | 5000 | - |
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RECAPTACLE, SHIELD |
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FFA.4S.155.LNN | LEMO | 5000 | - |
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MIDPIECE PAIR FOR FFA.4S. |
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2221682-1 | TE Connectivity Aerospace, Defense and Marine | 5000 | - |
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FAS-T PROT. COVER, RATCHET STYLE |
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45-VEAM | ITT Cannon, LLC | 5000 | - |
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IR 18 CAP RECP PLASTIC |
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075-8504-000 | ITT Cannon, LLC | 5000 | - |
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CONN FLANGE GASKET 16 16S |
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0914-201-1678 | TE Connectivity Deutsch Connectors | 5000 | - |
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SNAP RING |
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BME.5M.200.XAZ | LEMO | 5000 | - |
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CONN BLANKING COVER |
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9760-916 | Amphenol Industrial Operations | 5000 | - |
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97 D/C 16 16S RECP LINK CHAIN |
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213047-1 | TE Connectivity AMP Connectors | 5000 | - |
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SEALING PLUG,SZ 8,MIL 600 |
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FFA.4S.712.CN | LEMO | 5000 | - |
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CONN COLLET FFA.4S. - 12.0MM DIA |
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FGG.3K.866.TNS | LEMO | 5000 | - |
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CONN ADAPTER CABLE SILVER |
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46739-22/2 | ITT Cannon, LLC | 5000 | - |
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GSKT CIR 22 REAR PANEL SILICON |
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10-101937-028 | Amphenol Industrial Operations | 5000 | - |
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ER 06 O/R 28 |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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