Customized PCBs & Electronic Components — All in One Place
Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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GMA.4B.012.DJ | LEMO | 5000 | - |
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BEND RELIEF 12.0MM YELLOW |
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FFA.3S.792.LN | LEMO | 5000 | - |
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CONN COLLET SILVER |
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AHDM-BS-24NUT | Amphenol Sine Systems Corp | 5000 | - |
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CONN ADAPTER 24 BLACK |
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VS412353 | Radiall USA, Inc. | 5000 | - |
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C215R-16 #PANEL GASKET - FRONT M |
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JR13WCCA-6(72) | Hirose Electric Co Ltd | 5000 | - |
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CONN STRAIN RELIEF 13 SILVER |
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M85049/130-12F | Amphenol PCD | 5000 | - |
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GASKET BLUE FLUOROSILICONE FOR 5 |
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5204-0017-50 | Leader Tech Inc. | 5000 | - |
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AG/G FILLED SILICONE FLANGE MOUN |
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Y8601-7-8000000000 | TE Connectivity Deutsch Connectors | 5000 | - |
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O RING |
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GMA.4B.012.DR | LEMO | 5000 | - |
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CONN STRAIN RELIEF RED |
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FFA.3S.797.LN | LEMO | 5000 | - |
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CONN COLLET SILVER |
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WS-32-001 | WEC | 5000 | - |
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CONN WIRE SEAL RED |
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CL113000 | Souriau-Sunbank by Eaton | 5000 | - |
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CONN BACKNUT 3 BLACK |
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GMA.3B.080.DN | LEMO | 5000 | - |
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CONN STRAIN RELIEF BLACK |
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M85049/130-21N | Amphenol PCD | 5000 | - |
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GASKET BLACK NEOPRENE FOR 5015 C |
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5204-0017-60 | Leader Tech Inc. | 5000 | - |
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NI/C FILLED SILICONE FLANGE MOUN |
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81539-12 | TE Connectivity Deutsch Connectors | 5000 | - |
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PL SEAL |
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GMA.4B.012.DV | PEI-Genesis | 5000 | - |
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CONN STRAIN RELIEF GREEN |
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FFM.2E.130.LD | LEMO | 5000 | - |
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CONN BACK-NUT COLLET |
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AHD17-PN01 | Amphenol Sine Systems Corp | 5000 | - |
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CONN HEX NUT BLACK |
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CAP-WADMLPB2 | Amphenol LTW | 5000 | - |
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WATERPROOF CAP D SIZE(RJ&USB) |
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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