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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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BRA.0B.255.LN | LEMO | 5000 | - |
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CONN CAP LUG FOR BRA.0B. |
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MS25043-16DA | Amphenol PCD | 5000 | - |
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CONN PROTECTIVE COVER 16 BLACK |
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5204-0003-60 | Leader Tech Inc. | 5000 | - |
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NI/C FILLED SILICONE FLANGE MOUN |
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CKG.240.UG | LEMO | 5000 | - |
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CONN FRONT NUT GRAY |
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JR16WCCA-10(72) | Hirose Electric Co Ltd | 5000 | - |
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CONN STRAIN RELIEF 16 SILVER |
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5204-0026-30 | Leader Tech Inc. | 5000 | - |
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AG/CU FILLED FLOUROSILICONE FLAN |
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AHDC36-18 | Amphenol Sine Systems Corp | 5000 | - |
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CONN PROTECTIVE COVER 18 SILVER |
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164-895 | Amphenol PCD | 5000 | - |
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CAP AND CHAIN, FOR 164-183 |
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FFS.00.161.MN | LEMO | 5000 | - |
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CRIMP FERRULE FOR FFS.00. |
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MS25042-20D | Amphenol PCD | 5000 | - |
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CONN PROTECTIVE COVER 20 OLIVE |
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5204-0003-65 | Leader Tech Inc. | 5000 | - |
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AG/NI FILLED SILICONE FLANGE MOU |
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CKG.240.UJ | LEMO | 5000 | - |
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CONN FRONT NUT YELLOW |
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JR16WCCA-12(72) | Hirose Electric Co Ltd | 5000 | - |
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CONN STRAIN RELIEF 16 BLACK |
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5204-0026-45 | Leader Tech Inc. | 5000 | - |
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AG/CU FILLED SILICONE FLANGE MOU |
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EXP-0991 | Bulgin | 5000 | - |
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CONN SEALING COVER |
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FFA.0S.137.LC | LEMO | 5000 | - |
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OVERSIZED COLLET ADPT FFA.0S. |
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VS412402 | Radiall USA, Inc. | 5000 | - |
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C216-14 #PANEL GASKET - REAR M. |
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M85049/96-19 | Amphenol PCD | 5000 | - |
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1/4 PERIMETER MOUNTING FLANGE UN |
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5204-0003-75 | Leader Tech Inc. | 5000 | - |
Add To CartInquiry Now |
AG FILLED SILICONE FLANGE MOUNT |
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CKG.240.UN | LEMO | 5000 | - |
Add To CartInquiry Now |
CONN FRONT NUT BLACK |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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