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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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5204-0032-15 | Leader Tech Inc. | 5000 | - |
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AG/CU FILLED SILICONE FLANGE MOU |
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MS3185-20-1 | Amphenol Industrial Operations | 5000 | - |
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CONN POTTING BOOT 20 |
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701-023-208-965-070 | ODU | 5000 | - |
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CONN STRAIN RELIEF 1 BLACK |
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MS27501Z25A | Amphenol PCD | 5000 | - |
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DUST CAP SHELL SIZE 25 PLUG MIL |
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VS151147 | Radiall USA, Inc. | 5000 | - |
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CVB 043-36 F5 |
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5204-0031-10 | Leader Tech Inc. | 5000 | - |
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AG/CU FILLED SILICONE FLANGE MOU |
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FFM.2C.130.LC | LEMO | 5000 | - |
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CONN BACK-NUT COLLET SILVER |
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806-00086-00 | Chogori Technologies Inc. | 5000 | - |
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MIDDLE WATERPROOF COVER FOR MALE |
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1620927 | Phoenix Contact | 5000 | - |
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CONN SQUARE FLANGE SILVER |
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42296 | Conxall/Switchcraft | 5000 | - |
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CONN COVER 22-96 BLACK |
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701-023-206-965-025 | ODU | 5000 | - |
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CONN STRAIN RELIEF 1 BLUE |
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MS27502Z23A | Amphenol PCD | 5000 | - |
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DUST CAP SHELL SIZE 23 RECEPTAC |
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5204-0016-55 | Leader Tech Inc. | 5000 | - |
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AG FILLED SILICONE FLANGE MOUNT |
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VS151111 | Radiall USA, Inc. | 5000 | - |
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CVB 043-36 F7 |
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FFM.2S.130.LC | LEMO | 5000 | - |
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CONN BACK-NUT COLLET SILVER |
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806-00062-00 | Chogori Technologies Inc. | 5000 | - |
Add To CartInquiry Now |
STANDARD WATERPROOF COVER FOR FE |
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RM15TP-C(71) | Hirose Electric Co Ltd | 5000 | - |
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CONN DUST COVER 15 SILVER |
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213582-1 | TE Connectivity AMP Connectors | 5000 | - |
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CONN COUPLING RING 17 GRAY |
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701-023-206-965-030 | ODU | 5000 | - |
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CONN STRAIN RELIEF 1 BLUE |
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BRF.0S.200.NAS | LEMO | 5000 | - |
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CONN BLANKING COVER SILVER |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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