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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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770A508G | Winchester Interconnect | 5000 | - |
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CONN REDUCING ADAPT FOR UHF PLUG |
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GBSNS1P6QSK | Belden Inc. | 5000 | - |
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GROUND BLOCK ASSEMBLY |
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MM121504 | Murata Electronics | 5000 | - |
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HSC |
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310PP20 | Winchester Interconnect | 5000 | - |
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CONN PIN(M) GOLD #20AWG BNC/TNC |
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GBSNS1P6UK | Belden Inc. | 5000 | - |
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GROUND BLOCK ASSEMBLY |
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172-STAR-22.2MM | Amphenol RF | 5000 | - |
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N BHD LOCKWASHER 22.2MM O.D. |
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864LW | Winchester Interconnect | 5000 | - |
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CONN WASHER FOR F JACK |
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226599-6 | TE Connectivity AMP Connectors | 5000 | - |
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CONN FERRULE FOR UHF MINI CONN |
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202102-12 | Amphenol RF | 5000 | - |
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N MALE CAP WIRE CHAIN |
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864NT | Winchester Interconnect | 5000 | - |
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CONN NUT FOR F JACK |
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9-329049-0 | TE Connectivity AMP Connectors | 5000 | - |
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CONN FERRULE FOR COAXICON SERIES |
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GT5-2PP-HU(35) | Hirose Electric Co Ltd | 5000 | - |
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CONN HOUSING FOR M TERMINAL |
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FFA.0A.747.CN | LEMO | 5000 | - |
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CONN COLLET FFA.0A.-4.6MM DIA |
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2-323934-2 | TE Connectivity AMP Connectors | 5000 | - |
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CONN FERRULE RG58,141 CRIMP TIN |
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GT36-4BD0P-DSAD | Hirose Electric Co Ltd | 5000 | - |
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CONNECTOR |
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FLS.01.325.CK | LEMO | 5000 | - |
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INSULATOR CASING FOR FLS.01.325. |
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3FAH-NESJ-C01W6 | Amphenol RF | 5000 | - |
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FAKRA STRAIGHT TWIN CRIMP JACK F |
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GT36A-4ABP-DSA(H) | Hirose Electric Co Ltd | 5000 | - |
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CONNECTOR |
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FVN.03.731.LCN | LEMO | 5000 | - |
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CONN COLLET FVN.03.-3.1MM DIA |
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3FAH-NLSJ-C01W6 | Amphenol RF | 5000 | - |
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FAKRA STRAIGHT TWIN CRIMP JACK F |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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