Customized PCBs & Electronic Components — All in One Place
Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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PFN-2053 | ICP DAS USA INC | 5000 | - |
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PROFINET I/O MODULE (DRY CONTACT |
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750-435 | WAGO Corporation | 5000 | - |
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1-CHANNEL DIGITAL INPUT; NAMUR; |
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I-7067 | ICP DAS USA INC | 5000 | - |
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RS-485 REMOTE I/O DAQ MODULE: 7 |
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ET-7015 | ICP DAS USA INC | 5000 | - |
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7 CHANNEL RTD INPUTS WITH 3 WIRE |
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6ES71326BH000AA0 | Siemens Industry, Inc. | 5000 | - |
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ET 200SP. DQ 16X24VDC/0.5A BA. P |
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I-7016D | ICP DAS USA INC | 5000 | - |
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RS-485 REMOTE I/O DAQ MODULE: I- |
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M-7055 | ICP DAS USA INC | 5000 | - |
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MODBUS RTU REMOTE I/O DAQ MODULE |
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88970800 | Crouzet | 5000 | - |
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INPUT MODULE 3 ANALOG 24V |
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PET-7217 | ICP DAS USA INC | 5000 | - |
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MODBUS TCP POE REMOTE I/O DAQ MO |
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M-7041-A5 | ICP DAS USA INC | 5000 | - |
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MODBUS RTU RS-485 REMOTE I/O DAQ |
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6ES71326BH012BA0 | Siemens Industry, Inc. | 5000 | - |
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ET 200SP. DQ 16X 24V DC/0.5A ST. |
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M-7017R-A5 | ICP DAS USA INC | 5000 | - |
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MODBUS RTU RS-485 REMOTE I/O DAQ |
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TM-AD8C | ICP DAS USA INC | 5000 | - |
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COMPACT MODBUS RTU REMOTE I/O DA |
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6ES71326BH002BA0 | Siemens Industry, Inc. | 5000 | - |
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SIMAET 200SP, DQ 16X24VDC/0,5A S |
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M-7024R | ICP DAS USA INC | 5000 | - |
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MODBUS RTU RS-485 REMOTE I/O DAQ |
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M-7060D | ICP DAS USA INC | 5000 | - |
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MODBUS RTU REMOTE I/O DAQ MODULE |
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753-638 | WAGO Corporation | 5000 | - |
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2 UP/DOWN COUNTER; 16 BITS; 500 |
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M-7017Z | ICP DAS USA INC | 5000 | - |
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MODBUS RTU RS-485 REMOTE I/O DAQ |
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M-7060P | ICP DAS USA INC | 5000 | - |
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MODBUS RTU REMOTE I/O DAQ MODULE |
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6ES72221XF320XB0 | Siemens Industry, Inc. | 5000 | - |
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DIGITAL OUTPUT SM 1222, 8 DO, CH |
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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