Customized PCBs & Electronic Components — All in One Place
| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
|---|---|---|---|---|---|---|---|
|
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7-2151411-7 | TE Application Tooling | 5000 | 421.50 |
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OC-210F220O-CRIMPTOOLINGKIT |
|
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0634540153 | Molex | 5000 | 248.54 |
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INSULATION PUNCH |
|
|
0634540114 | Molex | 5000 | 400.87 |
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INSULATION PUNCH |
|
|
0011404126 | Molex | 5000 | 388.34 |
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8324-4 BARREL FORM PUNCH |
|
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0011404384 | Molex | 5000 | 279.61 |
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REAR COVER |
|
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0634430017 | Molex | 5000 | 279.61 |
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FR PLUNGER RET - NON CARRIER CUT |
|
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0190300128 | Molex | 5000 | 388.34 |
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MINI MAC DIE (UPPER INS.) |
|
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0634570068 | Molex | 5000 | 217.48 |
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CONDUCTOR PUNCH |
|
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7-2150198-7 | TE Application Tooling | 5000 | 421.50 |
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OC-210F250O-CRIMPTOOLINGKIT |
|
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0634540157 | Molex | 5000 | 248.54 |
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INSULATION PUNCH |
|
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0638015614 | Molex | 5000 | 400.87 |
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INSULATION PUNCH (I2 DIE) |
|
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0011404127 | Molex | 5000 | 388.34 |
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8324-5 INSULATION PUNCH |
|
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0011410058 | Molex | 5000 | 279.61 |
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SHOCK ABSORBER |
|
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0192880167 | Molex | 5000 | 279.61 |
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KRIMPING DIE ATP-BB-FIFG-E2 |
|
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0190475360 | Molex | 5000 | 388.34 |
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CRIMPING DIE #4 E1 (190475360) |
|
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0634570072 | Molex | 5000 | 217.48 |
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CONDUCTOR PUNCH |
|
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7-2150245-7 | TE Application Tooling | 5000 | 421.50 |
Add To CartInquiry Now |
OC-210F-CRIMPTOOLINGKIT |
|
|
0634541801 | Molex | 5000 | 248.54 |
Add To CartInquiry Now |
INSULATION PUNCH |
|
|
0638015514 | Molex | 5000 | 400.87 |
Add To CartInquiry Now |
CONDUCTOR PUNCH UPPER DIE |
|
|
0011404129 | Molex | 5000 | 388.34 |
Add To CartInquiry Now |
8324-7 BARREL FORM PUNCH |
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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