Customized PCBs & Electronic Components — All in One Place
| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
|---|---|---|---|---|---|---|---|
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745779-2 | TE Connectivity AMP Connectors | 5000 | - |
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CONN LATCH SPRING DB9-37 2/BAG |
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000-01-31-162 | JRH Electronics | 5000 | - |
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DUST CAP |
|
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DCC31P | Cinch Connectivity Solutions | 5000 | - |
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DURA-CON DUST COVER PLUG 31 POS |
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8900604007700 | HARTING | 5000 | - |
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114M3T12000 1.2-1.5 M3X6.2 |
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160X10969X | Conec | 5000 | - |
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PLASTIC DUSTCAP FOR ALL D-SUBMIN |
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SRX37-BLK | Kycon, Inc. | 5000 | - |
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STRAIN RELIEF 37 POSITION BLACK |
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SFP67SS25 | NorComp Inc. | 5000 | - |
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IP67 SEAL FLANGE 25POS SGL SIDED |
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000-01-31-163 | JRH Electronics | 5000 | - |
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DUST CAP |
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DCC31S | Cinch Connectivity Solutions | 5000 | - |
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DURA-CON DUST COVER SOCKET 31 PO |
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1731120001 | Molex | 5000 | - |
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FCT SLIDE LOCK FRAME SIZE1 |
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09670009987 | HARTING | 5000 | - |
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DSUB ISP 09P NUT-UNC-4,40 H7,5 |
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1731121299 | Molex | 5000 | - |
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FCT ACCESSORY |
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165X12969X | Conec | 5000 | - |
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CONN CAP DSUB9 FOR SOCKET |
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000-01-31-165 | JRH Electronics | 5000 | - |
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DUST CAP |
|
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DCC37S | Cinch Connectivity Solutions | 5000 | - |
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DURA-CON DUST COVER SOCKET 37 PO |
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1731121025 | Molex | 5000 | - |
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FCT BLIND HFREQ CRP RCPT 50 OHM |
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2-2308350-2 | TE Connectivity AMP Connectors | 5000 | - |
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CRIMP BARREL12 |
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1731121349 | Molex | 5000 | - |
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FCT ACCESSORY |
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165X13149X | Conec | 5000 | - |
Add To CartInquiry Now |
CONN CAP DSUB25 FOR PLUG |
|
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000-01-37-163 | JRH Electronics | 5000 | - |
Add To CartInquiry Now |
DUST CAP |
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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