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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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10380-3280-000-0 | 3M | 5000 | - |
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CONN BACKSHELL 80POS 180DEG SHLD |
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AGP-25/IDC | Assmann WSW Components | 5000 | - |
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CONN BACKSHELL 25POS 180DEG GRAY |
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10326-C200-00 | 3M | 5000 | - |
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CONN BACKSHELL 26POS 180DEG SHLD |
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957-009-010R031 | NorComp Inc. | 5000 | - |
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BACKSHELL GENDER CHANGER 9/9POS |
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DB25-HD-PN-SS | Adam Tech | 5000 | - |
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D-SUB HOOD METALIZED 25 WAY SHOR |
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AGP 37 G-NEW | Assmann WSW Components | 5000 | - |
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CONN BACKSHELL 37POS 180DEG BLK |
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1731110411 | Molex | 5000 | - |
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FCT HOOD |
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DB25-HD-PN-TS | Adam Tech | 5000 | - |
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D-SUB HOOD METALIZED 25 WAY THUM |
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1731110413 | Molex | 5000 | - |
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FCT HOOD |
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1731110377 | Molex | 5000 | - |
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FCT HOOD |
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A-FT 15 | Assmann WSW Components | 5000 | - |
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CONN BACKSHELL 15POS 180DEG BLK |
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7-1393738-7 | TE Connectivity AMP Connectors | 5000 | - |
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CONN BACKSHELL 50POS 37.5DEG GRY |
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957-025-010R011 | NorComp Inc. | 5000 | - |
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BACKSHELL GENDER CHANGER 25/25P |
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DA-19977-1 | Cinch Connectivity Solutions | 5000 | - |
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CONN BACKSHELL 15POS 90DEG |
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977-037-010R031 | NorComp Inc. | 5000 | - |
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CONN BACKSHELL 37POS 180DEG GRAY |
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09670370426 | HARTING | 5000 | - |
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D SUB PLASTIC HOOD BLACK 37 POLE |
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A-FT 25 | Assmann WSW Components | 5000 | - |
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CONN BACKSHELL 25POS 180DEG BLK |
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962-025-030R121 | NorComp Inc. | 5000 | - |
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CONN BACKSHELL 25POS 90DEG SHLD |
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165X10449X | Conec | 5000 | - |
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CONN BACKSHELL 15POS 90DEG BLACK |
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983-009-010R031 | NorComp Inc. | 5000 | - |
Add To CartInquiry Now |
CONN BACKSHELL 9POS 180DEG GRAY |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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