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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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L17DTZK50KFMT | Amphenol CS (Commercial Products) | 5000 | - |
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D SUB BACKSHELL |
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1731140611 | Molex | 5000 | - |
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FCT CONNECTOR HOOD KIT |
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1731110784 | Molex | 5000 | - |
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FCT HOOD |
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DX-36-CV1 | Hirose Electric Co Ltd | 5000 | - |
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CONN HOOD 36PIN |
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5749207-1 | TE Connectivity AMP Connectors | 5000 | - |
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CONN BACKSHELL 120POS 75DEG SHLD |
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ACOV-SUB-25MB3 | Assmann WSW Components | 5000 | - |
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CONN BACKSHELL 25POS 90DEG SHLD |
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1731100018 | Molex | 5000 | - |
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CONN BACKSHELL 25POS 180DEG BLK |
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DA-C4-J10-S2 | JAE Electronics | 5000 | - |
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DSUB JUNCTION SHELL |
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5787543-3 | TE Connectivity AMP Connectors | 5000 | - |
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CONN BACKSHELL 40POS 180DEG SHLD |
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1731110496 | Molex | 5000 | - |
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FCT HOOD S2 0 DEG PLSTC W/THMBSC |
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09670500335 | HARTING | 5000 | - |
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POSITION CONNECTOR |
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5747100-9 | TE Connectivity AMP Connectors | 5000 | - |
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CONN BACKSHELL 37POS 180DEG SHLD |
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XM2S-3712 | Omron Electronics Inc-EMC Div | 5000 | - |
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CONN BACKSHELL 37POS 180DEG SHLD |
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1-2308345-4 | TE Connectivity AMP Connectors | 5000 | - |
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CONN BACKSHELL 37P 45/180DEG SHD |
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DN-50-CVE1 | Hirose Electric Co Ltd | 5000 | - |
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BACKSHELL FOR D-SUB 50POS |
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09670090321 | HARTING | 5000 | - |
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D SUB TOP ENTRY METAL HOOD 9 POL |
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1731110347 | Molex | 5000 | - |
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FCT HOOD S1 45 DEG MTL W/SCRWLCK |
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1731140388 | Molex | 5000 | - |
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D-SUB WATERPROOFED PLASTIC BACKS |
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5747824-1 | WEC | 5000 | - |
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CONN BACKSHELL 25POS 180DEG BLK |
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5750752-1 | TE Connectivity AMP Connectors | 5000 | - |
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CONN BACKSHELL 68POS 180DEG SHLD |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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