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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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DS75-08B | IXYS | 5000 | 0.00 |
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DIODE GEN PURP 800V 110A DO203AB |
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HS183100 | Microchip Technology | 5000 | 0.00 |
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DIODE SCHOTTKY 100V 180A HALFPAK |
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DS75-12B | IXYS | 5000 | 0.00 |
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DIODE GEN PURP 1.2KV 110A DO203 |
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HS183100R | Microchip Technology | 5000 | 0.00 |
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DIODE SCHOTTKY 100V 180A HALFPAK |
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DS9-08F | IXYS | 5000 | 0.00 |
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DIODE GEN PURP 800V 11A DO203AA |
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1SS370TE85LF | Toshiba Semiconductor and Storage | 5000 | 0.00 |
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DIODE GEN PURP 200V 100MA SC70 |
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DS9-12F | IXYS | 5000 | 0.00 |
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DIODE GEN PURP 1.2KV 11A DO203AA |
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HS247200R | Microchip Technology | 5000 | 0.00 |
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DIODE SCHOTTKY 200V 240A HALFPAK |
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DSA17-12A | IXYS | 5000 | 0.00 |
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DIODE AVALANCHE 1.2KV 25A DO203 |
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HS12045R | Microchip Technology | 5000 | 0.00 |
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DIODE SCHOTTKY 45V 120A HALFPAK |
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DSA17-18A | IXYS | 5000 | 0.00 |
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DIODE AVALANCHE 1.8KV 25A DO203 |
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HS123100R | Microchip Technology | 5000 | 0.00 |
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DIODE SCHOTTKY 100V 120A HALFPAK |
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DSA2-12A | IXYS | 5000 | 0.00 |
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DIODE AVALANCHE 1200V 3.6A AXIAL |
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HS18135R | Microchip Technology | 5000 | 0.00 |
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DIODE SCHOTTKY 35V 180A HALFPAK |
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DSA2-18A | IXYS | 5000 | 0.00 |
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DIODE AVALANCHE 1800V 3.6A AXIAL |
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HS18140R | Microchip Technology | 5000 | 0.00 |
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DIODE SCHOTTKY 40V 180A HALFPAK |
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DSA35-12A | IXYS | 5000 | 0.00 |
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DIODE AVALANCHE 1.2KV 49A DO203 |
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HS18145R | Microchip Technology | 5000 | 0.00 |
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DIODE SCHOTTKY 45V 180A HALFPAK |
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DSA35-16A | IXYS | 5000 | 0.00 |
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DIODE AVALANCHE 1.6KV 49A DO203 |
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HS18230R | Microchip Technology | 5000 | 0.00 |
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DIODE SCHOTTKY 30V 180A HALFPAK |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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