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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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APA075-TQG100 | Microchip Technology | 5000 | 60.56 |
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IC FPGA 66 I/O 100TQFP |
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M7AFS600-FGG256 | Microchip Technology | 5000 | 220.97 |
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IC FPGA 119 I/O 256FBGA |
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M2GL090TS-1FCS325I | Microchip Technology | 5000 | 174.77 |
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IC FPGA 180 I/O 325BGA |
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XCVU125-2FLVC2104I | Xilinx Inc. | 5000 | 31329.33 |
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IC FPGA 416 I/O 2104FCBGA |
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AGL400V2-FG256I | Microchip Technology | 5000 | 56.24 |
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IC FPGA 178 I/O 256FBGA |
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XC3S1200E-5FTG256C | Xilinx Inc. | 5000 | 79.24 |
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IC FPGA 190 I/O 256FTBGA |
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XC3SD3400A-4FGG676I | Xilinx Inc. | 5000 | 162.40 |
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IC FPGA 469 I/O 676FBGA |
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XC6SLX16-3FT256I | Xilinx Inc. | 5000 | 60.62 |
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IC FPGA 186 I/O 256FTBGA |
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LFE2M70E-6FN900C | Lattice Semiconductor Corporation | 5000 | 221.00 |
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IC FPGA 416 I/O 900FBGA |
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M2GL090TS-1FCSG325I | Microchip Technology | 5000 | 174.77 |
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IC FPGA 180 I/O 324CSBGA |
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APA1000-LG624B | Microchip Technology | 5000 | 31717.10 |
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IC FPGA 440 I/O 624CLGA |
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LFE5UM5G-85F-8BG756C | Lattice Semiconductor Corporation | 5000 | 56.25 |
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IC FPGA 365 I/O 756CABGA |
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XC3S400-4FG320I | Xilinx Inc. | 5000 | 79.26 |
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IC FPGA 221 I/O 320FBGA |
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XC3SD3400A-4CSG484LI | Xilinx Inc. | 5000 | 162.40 |
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IC FPGA 309 I/O 484CSBGA |
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LIFCL-40-8BG400I | Lattice Semiconductor Corporation | 5000 | 60.65 |
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IC FPGA 192 I/O 400CABGA |
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LFE2M70E-5FN900I | Lattice Semiconductor Corporation | 5000 | 221.00 |
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IC FPGA 416 I/O 900FBGA |
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M1AGL1000V2-FGG256 | Microchip Technology | 5000 | 133.62 |
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IC FPGA 177 I/O 256FBGA |
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M1A3P1000L-FGG144I | Microchip Technology | 5000 | 175.12 |
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IC FPGA 97 I/O 144FBGA |
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XCVU7P-2FLVA2104E | Xilinx Inc. | 5000 | 31757.37 |
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IC FPGA 832 I/O 2104FCBGA |
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LFE2-35E-5FN484C | Lattice Semiconductor Corporation | 5000 | 56.25 |
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IC FPGA 331 I/O 484FBGA |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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