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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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A3PE600-FGG256I | Microchip Technology | 5000 | 63.66 |
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IC FPGA 165 I/O 256FBGA |
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XCVU160-3FLGB2104E | Xilinx Inc. | 5000 | 45511.23 |
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IC FPGA 702 I/O 2104FCBGA |
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A54SX16P-PQG208 | Microchip Technology | 5000 | 182.00 |
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IC FPGA 175 I/O 208QFP |
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APA300-FG144 | Microchip Technology | 5000 | 229.19 |
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IC FPGA 100 I/O 144FBGA |
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M2GL060TS-FG676I | Microchip Technology | 5000 | 139.88 |
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IC FPGA 387 I/O 676FBGA |
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MPF100TS-1FCVG484I | Microchip Technology | 5000 | 314.56 |
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IC FPGA 284 I/O 484FCBGA |
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XC3S1400A-4FG484I | Xilinx Inc. | 5000 | 129.43 |
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IC FPGA 375 I/O 484FBGA |
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XC7A15T-3CSG324E | Xilinx Inc. | 5000 | 63.70 |
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IC FPGA 210 I/O 324CSBGA |
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XCVU9P-1FLGB2104I | Xilinx Inc. | 5000 | 45941.73 |
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IC FPGA 702 I/O 2104FCBGA |
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XC3SD3400A-4FG676I | Xilinx Inc. | 5000 | 182.00 |
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IC FPGA 469 I/O 676FCBGA |
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M1A3PE1500-1FGG676 | Microchip Technology | 5000 | 229.50 |
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IC FPGA 444 I/O 676FBGA |
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M2GL060TS-FGG676I | Microchip Technology | 5000 | 139.88 |
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IC FPGA 387 I/O 676FBGA |
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XC6SLX100-3FG676I | Xilinx Inc. | 5000 | 314.60 |
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IC FPGA 480 I/O 676FCBGA |
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XC3SD1800A-5FGG676C | Xilinx Inc. | 5000 | 129.50 |
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IC FPGA 519 I/O 676FBGA |
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XC6SLX25-2FT256C | Xilinx Inc. | 5000 | 63.84 |
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IC FPGA 186 I/O 256FTBGA |
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XCVU13P-1FHGA2104E | Xilinx Inc. | 5000 | 47090.55 |
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IC FPGA 832 I/O 2104FCBGA |
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M1A3PE1500-1FG676 | Microchip Technology | 5000 | 229.50 |
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IC FPGA 444 I/O 676FBGA |
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AGL1000V5-FG484 | Microchip Technology | 5000 | 139.92 |
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IC FPGA 300 I/O 484FBGA |
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LFE3-150EA-8LFN1156C | Lattice Semiconductor Corporation | 5000 | 314.86 |
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IC FPGA 586 I/O 1156FBGA |
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M2GL090-1FCS325 | Microchip Technology | 5000 | 129.68 |
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IC FPGA 180 I/O 325BGA |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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