Customized PCBs & Electronic Components — All in One Place
| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
|---|---|---|---|---|---|---|---|
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A3P1000L-1FG144 | Microchip Technology | 5000 | 105.39 |
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IC FPGA 97 I/O 144FBGA |
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XC7K160T-1FBG484C | Xilinx Inc. | 5000 | 336.70 |
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IC FPGA 285 I/O 484FCBGA |
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XA3SD1800A-4FGG676I | Xilinx Inc. | 5000 | 231.40 |
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IC FPGA 519 I/O 676FBGA |
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XC6SLX150T-3CSG484C | Xilinx Inc. | 5000 | 319.80 |
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IC FPGA 296 I/O 484CSBGA |
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LFE2-50E-7FN484C | Lattice Semiconductor Corporation | 5000 | 130.00 |
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IC FPGA 339 I/O 484FBGA |
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M2GL090TS-FCS325 | Microchip Technology | 5000 | 140.94 |
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IC FPGA 180 I/O 325BGA |
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XCVU45P-1FSVH2104E | Xilinx Inc. | 5000 | 49378.35 |
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IC FPGA 416 I/O 2104FCBGA |
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XA7A25T-1CSG325Q | Xilinx Inc. | 5000 | 64.82 |
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IC FPGA 150 I/O 324CSBGA |
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M1A3P1000L-1FGG144 | Microchip Technology | 5000 | 105.39 |
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IC FPGA 97 I/O 144FBGA |
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MPF200T-1FCG784E | Microchip Technology | 5000 | 338.65 |
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IC FPGA 364 I/O 784FCBGA |
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A54SX32A-1PQG208 | Microchip Technology | 5000 | 232.19 |
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IC FPGA 174 I/O 208QFP |
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XC7K70T-L2FBG676E | Xilinx Inc. | 5000 | 319.80 |
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IC FPGA 300 I/O 676FCBGA |
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LFE2M50E-5FN484I | Lattice Semiconductor Corporation | 5000 | 130.00 |
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IC FPGA 270 I/O 484FBGA |
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M2GL090TS-FCSG325 | Microchip Technology | 5000 | 140.94 |
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IC FPGA 180 I/O 324CSBGA |
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XCVU27P-1FSGA2577E | Xilinx Inc. | 5000 | 49860.51 |
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IC FPGA 448 I/O 2577FCBGA |
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XC2S150-6FGG456C | Xilinx Inc. | 5000 | 65.03 |
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IC FPGA 260 I/O 456FBGA |
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A3P1000L-1FGG144 | Microchip Technology | 5000 | 105.39 |
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IC FPGA 97 I/O 144FBGA |
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MPF200TL-FCG784E | Microchip Technology | 5000 | 338.65 |
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IC FPGA 364 I/O 784FCBGA |
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A54SX32A-PQG208I | Microchip Technology | 5000 | 232.19 |
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IC FPGA 174 I/O 208QFP |
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A54SX32A-1FG484 | Microchip Technology | 5000 | 320.43 |
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IC FPGA 249 I/O 484FBGA |
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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