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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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10M16DCU324C8G | Intel | 5000 | 0.00 |
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IC FPGA 246 I/O 324UBGA |
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LFSCM3GA80EP1-6FFN1704I | Lattice Semiconductor Corporation | 5000 | 0.00 |
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IC FPGA 904 I/O 1704FCBGA |
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XC7VX415T-2FF1927I | Xilinx Inc. | 5000 | 12119.19 |
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IC FPGA 600 I/O 1927FCBGA |
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AT40K10LV-3EQI | Microchip Technology | 5000 | 0.00 |
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IC FPGA 193 I/O 240QFP |
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EP2C8T144I8N | Intel | 5000 | 0.00 |
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IC FPGA 85 I/O 144TQFP |
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APA750-BG456 | Microchip Technology | 5000 | 1344.56 |
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IC FPGA 356 I/O 456BGA |
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XCVU095-2FFVD1517E | Xilinx Inc. | 5000 | 19928.46 |
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IC FPGA 338 I/O 1517FCBGA |
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XC5VFX70T-1FF665C | Xilinx Inc. | 5000 | 1548.30 |
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IC FPGA 360 I/O 665FCBGA |
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10M16SCE144C8G | Intel | 5000 | 0.00 |
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IC FPGA 101 I/O 144EQFP |
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LFSCM3GA80EP1-6FFN1152I | Lattice Semiconductor Corporation | 5000 | 0.00 |
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IC FPGA 660 I/O 1152FBGA |
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XC7V585T-3FFG1761E | Xilinx Inc. | 5000 | 12131.49 |
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IC FPGA 850 I/O 1761FCBGA |
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AT40K20-2AJI | Microchip Technology | 5000 | 0.00 |
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IC FPGA 62 I/O 84PLCC |
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EP3C10F256C7N | Intel | 5000 | 0.00 |
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IC FPGA 182 I/O 256FBGA |
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APA750-BGG456 | Microchip Technology | 5000 | 1344.56 |
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IC FPGA 356 I/O 456BGA |
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XC5VLX330T-1FFG1738C | Xilinx Inc. | 5000 | 20132.64 |
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IC FPGA 960 I/O 1738FCBGA |
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XC4VLX60-11FF668C | Xilinx Inc. | 5000 | 1548.30 |
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IC FPGA 448 I/O 668FCBGA |
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10M50DCF484C8G | Intel | 5000 | 0.00 |
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IC FPGA 360 I/O 484FBGA |
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LFSCM3GA80EP1-5FFN1704I | Lattice Semiconductor Corporation | 5000 | 0.00 |
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IC FPGA 904 I/O 1704FCBGA |
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A54SX32A-CQ256B | Microchip Technology | 5000 | 12167.59 |
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IC FPGA 203 I/O 256CQFP |
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AT40K20-2AQC | Microchip Technology | 5000 | 0.00 |
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IC FPGA 78 I/O 100TQFP |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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