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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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XPDNC200S-01 | Lantronix, Inc. | 5000 | 75.55 |
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IC MOD DSTNI-EX 25MHZ 256KB |
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TE0720-03-64I63FA | Trenz Electronic GmbH | 5000 | 0.00 |
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IC SOC MODULE XILINX ZYNQ |
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TE0741-03-070-2IF | Trenz Electronic GmbH | 5000 | 440.00 |
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IC MOD KINTEX-7 70T 200MHZ 32MB |
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TE0741-04-B3E-1-AF | Trenz Electronic GmbH | 5000 | 0.00 |
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MODULE FPGA KINTEX |
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EDM1-IMX6S-MSD | Wandboard.Org | 5000 | 85.70 |
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IC MODULE CORTEX-A9 512MB 10PK |
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TE0720-03-62I330M | Trenz Electronic GmbH | 5000 | 0.00 |
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IC SOC MODULE XILINX ZYNQ |
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MA-ZX3-20-2I-D10-R7 | Enclustra FPGA Solutions | 5000 | 455.18 |
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SOM ZYNQ 7Z020 1GB |
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TE0741-03-B3E-1-AF | Trenz Electronic GmbH | 5000 | 0.00 |
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MODULE FPGA KINTEX |
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TE0722-02 | Trenz Electronic GmbH | 5000 | 87.75 |
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IC MODULE CORTEX-A9 33MHZ 16MB |
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TE0720-03-2IFC1 | Trenz Electronic GmbH | 5000 | 0.00 |
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IC SOC MODULE XILINX ZYNQ |
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5CSX-H6-4YA-RI | Critical Link LLC | 5000 | 712.72 |
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IC MOD CORTEX-A9 800MHZ 1GB 32MB |
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TE0741-04-G2I-1-A | Trenz Electronic GmbH | 5000 | 0.00 |
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MODULE FPGA KINTEX |
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SOMDIMM-RX63N | Future Designs Inc. | 5000 | 105.00 |
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IC MOD RX600/RX63N 100MHZ 128KB |
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TE0720-03-61C33FA | Trenz Electronic GmbH | 5000 | 0.00 |
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IC SOC MODULE XILINX ZYNQ |
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TE0741-03-410-2CF | Trenz Electronic GmbH | 5000 | 1174.80 |
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IC MOD KINTEX-7 410T 200MHZ 32MB |
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TE0741-04-D2C-1-A | Trenz Electronic GmbH | 5000 | 0.00 |
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MODULE FPGA KINTEX |
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EDM1-IMX6U-MSD-BW | Wandboard.Org | 5000 | 116.33 |
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IC MODULE CORTEX-A9 1GB |
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TE0729-02-62I63FA | Trenz Electronic GmbH | 5000 | 0.00 |
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IC SOC MODULE ZYNQ |
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ME-XU1-15EG-2I-D12E-R4.1 | Enclustra FPGA Solutions | 5000 | 2964.38 |
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SOM ZYNQ US+ ZU15EG 4GB |
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TE0741-04-A2C-1-A | Trenz Electronic GmbH | 5000 | 0.00 |
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MODULE FPGA KINTEX |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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