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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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OMAP3530DCBCA | Rochester Electronics, LLC | 5000 | 51.20 |
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IC MPU OMAP-35XX 720MHZ 515FCBGA |
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MPC8379ECVRALGA | NXP USA Inc. | 5000 | 0.00 |
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IC MPU MPC83XX 667MHZ 689TEBGA |
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T1020NSE7MQB | NXP USA Inc. | 5000 | 177.47 |
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IC SOC 2CORE 1200MHZ SW 780FCBGA |
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KMC68LC302AF25CT | NXP USA Inc. | 5000 | 0.00 |
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IC MPU M683XX 25MHZ 100LQFP |
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XLP780B1IFSB00120X | Broadcom Limited | 5000 | 0.00 |
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FCBGA+HS 55X55 2870 |
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FS32V234CKN1VUB | NXP USA Inc. | 5000 | 138.88 |
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ISP CSE 1GHZ 4 CORES |
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MPC8245LZU266D | Flip Electronics | 5000 | 86.51 |
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IC MPU MPC82XX 266MHZ 352TBGA |
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OMAP3530DCUS | Rochester Electronics, LLC | 5000 | 42.66 |
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IC MPU OMAP-35XX 720MHZ 423FCBGA |
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MPC8541ECVTAJD | Flip Electronics | 5000 | 0.00 |
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IC MPU MPC85XX 533MHZ 783FCBGA |
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MPC8379ECVRANGA | NXP USA Inc. | 5000 | 0.00 |
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IC MPU MPC83XX 800MHZ 689TEBGA |
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LS1026AXE8T1A | NXP USA Inc. | 5000 | 177.87 |
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QORIQ LAYERSCAPE 2XA72 64BIT ARM |
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KMC68MH360AI33L | NXP USA Inc. | 5000 | 0.00 |
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IC MPU M683XX 33MHZ 240FQFP |
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XLP964B1IFSB00120X | Broadcom Limited | 5000 | 0.00 |
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FCBGA+HS 55X55 2870 |
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MPC8247VRTMFA | NXP USA Inc. | 5000 | 138.92 |
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IC MPU MPC82XX 400MHZ 516BGA |
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MPC8245LZU300D | Flip Electronics | 5000 | 106.54 |
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IC MPU MPC82XX 300MHZ 352TBGA |
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OMAP3530DCUS72 | Rochester Electronics, LLC | 5000 | 51.20 |
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IC MPU OMAP-35XX 720MHZ 423FCBGA |
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MPC8541ECVTALF | Flip Electronics | 5000 | 253.27 |
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IC MPU MPC85XX 667MHZ 783FCBGA |
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MPC8379EVRAGDA | NXP USA Inc. | 5000 | 0.00 |
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IC MPU MPC83XX 400MHZ 689TEBGA |
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T1042NSN7MQB | NXP USA Inc. | 660 | 0.00 |
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Integrated Circuits |
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KMC68MH360CAI25L | NXP USA Inc. | 5000 | 0.00 |
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IC MPU M683XX 25MHZ 240FQFP |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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