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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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10AS032E1F29E1HG | Intel | 5000 | 0.00 |
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IC SOC CORTEX-A9 1.5GHZ 780FBGA |
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ADM8668FXA12G | Rochester Electronics, LLC | 5000 | 15.34 |
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WIRELESS NETWORK BRIDGING SOC |
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10AS032E1F29I1HG | Intel | 5000 | 0.00 |
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IC SOC CORTEX-A9 1.5GHZ 780FBGA |
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UPD72893BGD-LML-A | Rochester Electronics, LLC | 5000 | 21.13 |
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SOC / AV LINK |
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10AS032E2F27E1HG | Intel | 5000 | 0.00 |
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IC SOC CORTEX-A9 1.5GHZ 672FBGA |
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PLCHIP-P10-51220X1 | Divelbiss Corporation | 5000 | 66.93 |
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P10 PLC ON A CHIP SINGLE, LQFP- |
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10AS032E2F27I1HG | Intel | 5000 | 0.00 |
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IC SOC CORTEX-A9 1.5GHZ 672FBGA |
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PLCHIP-P13-51220X1 | Divelbiss Corporation | 5000 | 78.08 |
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P13 PLC ON A CHIP SINGLE, LQFP-2 |
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10AS032E2F29E1HG | Intel | 5000 | 0.00 |
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IC SOC CORTEX-A9 1.5GHZ 780FBGA |
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PLCHIP-P10-51220X5 | Divelbiss Corporation | 5000 | 301.20 |
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P10 PLC ON A CHIP 5 PACK, LQFP- |
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10AS032E2F29I1HG | Intel | 5000 | 0.00 |
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IC SOC CORTEX-A9 1.5GHZ 780FBGA |
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PLCHIP-P13-51220X5 | Divelbiss Corporation | 5000 | 351.35 |
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P13 PLC ON A CHIP 5 PACK, LQFP-2 |
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10AS032H1F34E1HG | Intel | 5000 | 0.00 |
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IC SOC CORTEX-A9 1.5GHZ 1152FBGA |
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PLCHIP-P10-51220X10 | Divelbiss Corporation | 5000 | 557.80 |
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P10 PLC ON A CHIP 10 PACK, LQFP |
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10AS032H1F34I1HG | Intel | 5000 | 0.00 |
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IC SOC CORTEX-A9 1.5GHZ 1152FBGA |
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PLCHIP-P13-51220X10 | Divelbiss Corporation | 5000 | 650.60 |
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P13 PLC ON A CHIP 10 PACK, LQFP- |
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10AS032H1F35E1HG | Intel | 5000 | 0.00 |
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IC SOC CORTEX-A9 1.5GHZ 1152FBGA |
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M2S150T-1FCG1152M | Microchip Technology | 5000 | 2774.10 |
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IC SOC CORTEX-M3 166MHZ 1152BGA |
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10AS032H1F35I1HG | Intel | 5000 | 0.00 |
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IC SOC CORTEX-A9 1.5GHZ 1152FBGA |
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XCZU7CG-1FFVC1156I | Xilinx Inc. | 5000 | 3276.72 |
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IC SOC CORTEX-A53 1156FCBGA |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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