Customized PCBs & Electronic Components — All in One Place
| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
|---|---|---|---|---|---|---|---|
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FHCZA-12-10BN | Panduit Corp | 5000 | - |
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HD FLEX CASSETTE; 1 MPO TO 6 DUP |
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5503480-2 | WEC | 5000 | - |
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CONN ADAPTER RCPT SC-FC SIMPLEX |
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1060043298 | Molex | 5000 | - |
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CONN COUPLER MTP-MTP SIMPLEX |
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ECO-P-S2-SC6D | TechLogix Networx | 5000 | - |
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FIBER PANEL INSERT -- SM |
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1060043076 | Molex | 5000 | - |
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CONN COUPLER RCPT SC-SC SIMPLEX |
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F1RCZO-9612-10S | Panduit Corp | 5000 | - |
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12-FIBER HIGH DENSITY OM4 MTP TO |
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FCSL12LDMF | Belden Inc. | 5000 | - |
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FXU A_CASS_L OS2 12P MPO12(F) |
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5503638-2 | TE Connectivity AMP Connectors | 5000 | - |
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CONN ADAPTER RCPT SC-ST SIMPLEX |
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CMDABLLCZBL | Panduit Corp | 5000 | - |
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MINI-COM KEYED (A-BL) DUPLEX LC |
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ECO-P-S2-SC6S | TechLogix Networx | 5000 | - |
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FIBER PANEL INSERT -- SM |
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1060043078 | Molex | 5000 | - |
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CONN COUPLER RCPT LC-LC SIMPLEX |
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6374223-3 | TE Connectivity AMP Connectors | 5000 | - |
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CONN COUPLER RCPT SC-SC DUPLEX |
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F1ASZO-9612-10S | Panduit Corp | 5000 | - |
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12-FIBER HIGH DENSITY OM4 FIBER |
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FCSL12LDMF1B | Belden Inc. | 5000 | - |
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FXU A_CASS_L OS2 12P MPO12(F) |
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5503640-2 | TE Connectivity AMP Connectors | 5000 | - |
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CONN ADAPTER RCPT FC-ST SIMPLEX |
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CMDABLLCZBU | Panduit Corp | 5000 | - |
Add To CartInquiry Now |
MINI-COM KEYED (A-BL) DUPLEX LC |
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FOA-LC-LC-SS-25 | Tower Products | 5000 | - |
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SM LC-LC SIMPLEX COUPLER 25PK |
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1060043079 | Molex | 5000 | - |
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CONN COUPLER RCPT LC-LC SIMPLEX |
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559594-1 | TE Connectivity AMP Connectors | 5000 | - |
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CONN COUPLER RCPT SC-SC 16-PLEX |
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FHCT-5ZUB | Panduit Corp | 5000 | - |
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TAP CASSETTE OM4 1 MPO LIVE IN |
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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