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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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AFBR-89CDDZ | Broadcom Limited | 5000 | - |
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TXRX QSFP28 100GBPS 850NM |
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AFBR-89CEDZ | Broadcom Limited | 5000 | - |
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TXRX QSFP28 100GBPS 850NM |
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AFCT-57D3ANMZ | Broadcom Limited | 5000 | - |
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TXRX SFP+ 8.5GBD 1310NM |
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AFCT-57D3ATMZ | Broadcom Limited | 5000 | - |
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TXRX SFP+ 8.5GBD 1310NM |
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AFCT-739ASMZ | Broadcom Limited | 5000 | - |
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TXRX SFP+ 10GBD 1310NM |
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AFCT-739DMZ | Broadcom Limited | 5000 | - |
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TXRX SFP+ 10GBD 1310NM |
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AFCT-739ISMZ | Broadcom Limited | 5000 | - |
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TXRX SFP+ 10GBD 1310NM |
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AFCT-739SMZ | Broadcom Limited | 5000 | - |
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TXRX SFP+ 10GBD 1310NM |
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AFCT-8450Z | Broadcom Limited | 5000 | - |
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TXRX CFP 100GBPS |
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AFCT-88EEDZ | Broadcom Limited | 5000 | - |
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40GE QSFP+LR4, BAIL |
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AFCT-88EEPZ | Broadcom Limited | 5000 | - |
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40GE QSFP+LR4 |
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AFCT-88EIPZ | Broadcom Limited | 5000 | - |
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40GE QSFP+LR4-LITE |
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FTGN2117P2CUN | Finisar Corporation | 5000 | - |
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SFP,1310NM DFB,SM,GPON STICK,APD |
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FTGN2117P2TAN | Finisar Corporation | 5000 | - |
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SFP,1310NM DFB,SM,GPON STICK,APD |
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FTGN2117P2TUN | Finisar Corporation | 5000 | - |
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SFP,1310NM DFB,SM,GPON STICK,APD |
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FTL410QD3C | Finisar Corporation | 5000 | - |
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TRANSCEIVER QSFP, 4X 10.5GB/S,40 |
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FTL4C1QL1C | Finisar Corporation | 5000 | - |
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TRANSCEIVER QSFP, 2KM, 40GE LITE |
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FTL4C1QL1L | Finisar Corporation | 5000 | - |
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TRANSCEIVER QSFP, 2KM, 40GE LITE |
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FTL4C2QE1C | Finisar Corporation | 5000 | - |
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TRANSCEIVER QSFP, 140M ON OM3 / |
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FTL4C3QE1C | Finisar Corporation | 5000 | - |
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TRANSCEIVER QSFP, 140M ON OM3 / |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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