Customized PCBs & Electronic Components — All in One Place
Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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2518121218Y3 | Fair-Rite Products Corp. | 5000 | - |
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MULTI-LAYER CHIP BEAD |
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782631182 | Würth Elektronik | 5000 | - |
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FERRITE BEAD 1.8 KOHM 0603 1LN |
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Z0402C100APMST | KEMET | 5000 | - |
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POWER LINE FERRITE CHIP BEAD 10, |
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2508055008Y0 | Fair-Rite Products Corp. | 5000 | - |
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MULTI-LAYER CHIP BEAD |
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BKP1005EM121-TV | Taiyo Yuden | 5000 | - |
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FERRITE BEAD 0402 SMD |
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BBPY00160808331Y00 | Yageo | 5000 | - |
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FERRITE BEAD 330 OHM 0603 1LN |
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2518121218Y6 | Fair-Rite Products Corp. | 5000 | - |
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MULTI-LAYER CHIP BEAD |
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2743003112 | Fair-Rite Products Corp. | 5000 | - |
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FERRITE BEAD AXIAL 1LN |
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BLM15BD182SH1D | Murata Electronics | 5000 | - |
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FERRITE BEAD 1.8K OHM 0402 1LN |
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2508059008Y0 | Fair-Rite Products Corp. | 5000 | - |
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MULTI-LAYER CHIP BEAD |
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BKP1005TS121-T8 | Taiyo Yuden | 5000 | - |
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FERRITE BEAD 0402 SMD |
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BBPY00160808471Y00 | Yageo | 5000 | - |
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FERRITE BEAD 470 OHM 0603 1LN |
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2518127008Y3 | Fair-Rite Products Corp. | 5000 | - |
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MULTI-LAYER CHIP BEAD |
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BLM03HD471SN1D | Murata Electronics | 5000 | - |
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FERRITE BEAD 470 OHM 0201 1LN |
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LI0603E470R-10 | Laird-Signal Integrity Products | 5000 | - |
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FERRITE BEAD 47 OHM 0603 1LN |
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2506031026Y0 | Fair-Rite Products Corp. | 5000 | - |
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MULTI-LAYER CHIP BEAD |
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BK1608HW680-T | Taiyo Yuden | 5000 | - |
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FERRITE BEAD 0603 SMD |
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PZ1608U471-1R0TF | Shenzhen Sunlord Electronics Co., Ltd. | 5000 | - |
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FERRITE BEAD 47025%OHM 0603 1LN |
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HF30ACB321611-TD25 | TDK Corporation | 5000 | - |
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FERRITE BEAD 19 OHM 1206 1LN |
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HZ0805B272R-10 | Laird-Signal Integrity Products | 5000 | - |
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FERRITE BEAD 2.7 KOHM 0805 1LN |
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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