Customized PCBs & Electronic Components — All in One Place
Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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CIB31P600NE | Samsung Electro-Mechanics | 5000 | - |
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FERRITE BEAD 60 OHM 1206 1LN |
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CIV05J182NC | Samsung Electro-Mechanics | 5000 | - |
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FERRITE BEAD 1.8 KOHM 0402 1LN |
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BK32164S600-TV | Taiyo Yuden | 5000 | - |
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FERRITE BEAD 1206 SMD |
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2506033316H0 | Fair-Rite Products Corp. | 5000 | - |
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MULTI-LAYER CHIP BEAD |
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BLM21BD751SN1D | Murata Electronics | 5000 | - |
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FERRITE BEAD 750 OHM 0805 1LN |
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CIM31J151NE | Samsung Electro-Mechanics | 5000 | - |
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FERRITE BEAD 150 OHM 1206 1LN |
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CIS10P221NC | Samsung Electro-Mechanics | 5000 | - |
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FERRITE BEAD 220 OHM 0603 1LN |
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BK2125HM821-T | Taiyo Yuden | 5000 | - |
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FERRITE BEAD 0805 SMD |
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2506031218H0 | Fair-Rite Products Corp. | 5000 | - |
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MULTI-LAYER CHIP BEAD |
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BBPY00321611500Y00 | Yageo | 5000 | - |
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FERRITE BEAD 50 OHM 1206 1LN |
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CIM31J601NE | Samsung Electro-Mechanics | 5000 | - |
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FERRITE BEAD 600 OHM 1206 1LN |
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CIS10P260AC | Samsung Electro-Mechanics | 5000 | - |
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FERRITE BEAD 26 OHM 0603 1LN |
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BK0402HS470-T | Taiyo Yuden | 5000 | - |
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FERRITE BEAD 0402 SMD |
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2506033318H0 | Fair-Rite Products Corp. | 5000 | - |
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MULTI-LAYER CHIP BEAD |
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BLM21AG471SH1D | Murata Electronics | 5000 | - |
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FERRITE BEAD 470 OHM 0805 1LN |
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CIM31J102NE | Samsung Electro-Mechanics | 5000 | - |
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FERRITE BEAD 1 KOHM 1206 1LN |
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CIS10P300AC | Samsung Electro-Mechanics | 5000 | - |
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FERRITE BEAD 30 OHM 0603 1LN |
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BKP1005EM221-TV | Taiyo Yuden | 5000 | - |
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FERRITE BEAD 0402 SMD |
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BLM18EG101TH1D | Murata Electronics | 5000 | - |
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FERRITE CHIP 100 OHM 2A 0603 |
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BLM18HD601SH1D | Murata Electronics | 5000 | - |
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FERRITE BEAD 600 OHM 0603 1LN |
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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