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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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M-8888-01P | IXYS Integrated Circuits Division | 5000 | 0.00 |
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IC TELECOM INTERFACE 20DIP |
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BCM56070A0IFSBG | Broadcom Limited | 5000 | 505.08 |
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LINE CARD, 25G CONNECTIVITY I-TE |
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DS26303LN-120+ | Analog Devices Inc./Maxim Integrated | 5000 | 0.00 |
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IC TELECOM INTERFACE 144-LQFP |
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XRT75L02DIVTR-F | MaxLinear, Inc. | 5000 | 0.00 |
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IC TELECOM INTERFACE 100TQFP |
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CPC7593BCTR | IXYS Integrated Circuits Division | 5000 | 0.00 |
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IC TELECOM INTERFACE 28SOIC |
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SI3216-C-GMR | Skyworks Solutions Inc. | 5000 | 0.00 |
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IC TELECOM INTERFACE 38QFN |
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BCM56854XA2IFSBLG | Broadcom Limited | 5000 | 0.00 |
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MULTI LAYER SWITCH 10G |
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M-980-02P | IXYS Integrated Circuits Division | 5000 | 0.00 |
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IC TELECOM INTERFACE 8DIP |
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PM8311A-FEI | Microchip Technology | 5000 | 508.87 |
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IC TELECOM INTERFACE |
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DS3150QC1+ | Rochester Electronics, LLC | 5000 | 27.07 |
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IC TELECOM INTERFACE 28PLCC |
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XRT75L02IV-F | MaxLinear, Inc. | 5000 | 0.00 |
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IC TELECOM INTERFACE 100TQFP |
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CPC7593ZA | IXYS Integrated Circuits Division | 5000 | 0.00 |
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IC TELECOM INTERFACE 20SOIC |
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BCM56855A2IFSBLG | Broadcom Limited | 5000 | 0.00 |
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MULTI LAYER SWITCH 10G |
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M-8870-02 | IXYS Integrated Circuits Division | 5000 | 0.00 |
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IC TELECOM INTERFACE 18DIP |
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BCM957414N4140C | Broadcom Limited | 5000 | 517.07 |
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N225P WH 2 X 25G OCP 3.0 GENERIC |
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DS2155LC2+ | Analog Devices Inc./Maxim Integrated | 5000 | 0.00 |
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IC TELECOM INTERFACE 100LQFP |
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XRT75L02IVTR-F | MaxLinear, Inc. | 5000 | 0.00 |
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IC TELECOM INTERFACE 100TQFP |
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CPC7593ZATR | IXYS Integrated Circuits Division | 5000 | 0.00 |
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IC TELECOM INTERFACE 20SOIC |
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BCM56855A2KFSBLG | Broadcom Limited | 5000 | 0.00 |
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MULTI LAYER SWITCH 10G |
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BCM56340A0KFSBLG | Broadcom Limited | 5000 | 538.11 |
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48GE + 4X 10GE + STACK |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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