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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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BCM56471A0IFSBG | Broadcom Limited | 5000 | 2980.80 |
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1700 GBPS AGGREGATION SWITCH I-T |
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SI32177-C-GM1R | Skyworks Solutions Inc. | 5000 | 0.00 |
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IC TELECOM INTERFACE 42QFN |
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MT8888CE1 | Microchip Technology | 5000 | 0.00 |
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IC TELECOM INTERFACE 20DIP |
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XRT5894IVTR-F | MaxLinear, Inc. | 5000 | 0.00 |
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IC TELECOM INTERFACE 64TQFP |
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PM5336B-FXI | Microchip Technology | 5000 | 0.00 |
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IC TELECOM INTERFACE |
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BCM56544B0IFSBG | Broadcom Limited | 5000 | 0.00 |
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IC TELECOM INTERFACE MULTI LAYER |
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VSC8574EV | Microchip Technology | 5000 | 3116.08 |
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IC TELECOM INTERFACE |
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SI32179-B-GM1R | Skyworks Solutions Inc. | 5000 | 0.00 |
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IC TELECOM INTERFACE 42QFN |
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MT8888CPR1 | Microchip Technology | 5000 | 0.00 |
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IC TELECOM INTERFACE 28PLCC |
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XRT5897IV-F | MaxLinear, Inc. | 5000 | 0.00 |
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IC TELECOM INTERFACE 100TQFP |
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PM5370-FGI | Microchip Technology | 5000 | 0.00 |
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IC TELECOM INTERFACE 672FCBGA |
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BCM56544XB0IFSBG | Broadcom Limited | 5000 | 0.00 |
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IC TELECOM INTERFACE MULTI LAYER |
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BCM56834A2KFSBLG | Broadcom Limited | 5000 | 3391.70 |
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56834 C-TEMP ROHS6 |
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SI32911-A-GS | Skyworks Solutions Inc. | 5000 | 0.00 |
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IC TELECOM INTERFACE 16SOIC |
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MT8889CE1 | Microchip Technology | 5000 | 0.00 |
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IC TELECOM INTERFACE 20DIP |
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XRT59L921IB | MaxLinear, Inc. | 5000 | 0.00 |
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IC TELECOM INTERFACE 316STBGA |
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PM5370-FI | Microchip Technology | 5000 | 0.00 |
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IC TELECOM INTERFACE 672FCBGA |
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BCM56545B0IFSBG | Broadcom Limited | 5000 | 0.00 |
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IC TELECOM INTERFACE MULTI LAYER |
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BCM88750B0KFSBLG | Broadcom Limited | 5000 | 3927.86 |
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128 X 11.5GBPS FABRIC DEVICE |
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SI32911-A-GSR | Skyworks Solutions Inc. | 5000 | 0.00 |
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IC TELECOM INTERFACE 16SOIC |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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