Customized PCBs & Electronic Components — All in One Place
| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
|---|---|---|---|---|---|---|---|
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MT53B256M32D1NP-062 WT ES:C TR | Micron Technology Inc. | 5000 | 0.00 |
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IC DRAM 8GBIT 1600MHZ 200WFBGA |
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MT28EW01GABA1HJS-0SIT | Micron Technology Inc. | 5000 | 0.00 |
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IC FLASH 1GBIT PARALLEL 56TSOP |
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25LC320A-I/WF16K | Microchip Technology | 5000 | 0.00 |
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IC EEPROM 32KBIT SPI 10MHZ DIE |
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W632GG6MB12I | Winbond Electronics | 5000 | 0.00 |
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IC DRAM 2GBIT PARALLEL 96VFBGA |
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5962F1120202QXA | Cypress Semiconductor Corp | 5000 | 0.00 |
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IC SRAM 72MBIT PARALLEL 165CCGA |
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MT53D4DESB-DC | Micron Technology Inc. | 5000 | 0.00 |
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LPDDR4 0 384MX64 FBGA QDP |
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IS62WV25616DBLL-45BI | ISSI, Integrated Silicon Solution Inc | 5000 | 0.00 |
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IC SRAM 4MBIT PARALLEL 48MINIBGA |
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MT53B256M64D2NK-062 WT:C TR | Micron Technology Inc. | 5000 | 0.00 |
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IC DRAM 16GBIT 1600MHZ FBGA |
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MT28EW01GABA1HPC-0SIT | Micron Technology Inc. | 5000 | 0.00 |
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IC FLASH 1GBIT PARALLEL 64LBGA |
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25LC320/S | Microchip Technology | 5000 | 0.00 |
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IC EEPROM 32KBIT SPI 2MHZ DIE |
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W632GG6MB12J | Winbond Electronics | 5000 | 0.00 |
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IC DRAM 2GBIT PARALLEL 96VFBGA |
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W25Q64JVDAIM | Winbond Electronics | 5000 | 0.00 |
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IC FLASH 64MBIT SPI 8DIP |
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MT53D768M64D4SQ-053 WT:A TR | Micron Technology Inc. | 5000 | 0.00 |
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LPDDR4 48G 768MX64 FBGA QDP |
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MT53D4DGSB-DC | Micron Technology Inc. | 5000 | 0.00 |
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SPECIAL/CUSTOM LPDDR4 |
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IS62WV25616DBLL-45BI-TR | ISSI, Integrated Silicon Solution Inc | 5000 | 0.00 |
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IC SRAM 4MBIT PARALLEL 48MINIBGA |
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MT53B256M64D2NV-062 XT ES:C TR | Micron Technology Inc. | 5000 | 0.00 |
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IC DRAM 16GBIT 1600MHZ FBGA |
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MT28EW128ABA1HPC-1SIT | Micron Technology Inc. | 5000 | 0.00 |
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IC FLASH 128MBIT PARALLEL 64LBGA |
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25LC320/WF | Microchip Technology | 5000 | 0.00 |
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IC EEPROM 32KBIT SPI 2MHZ DIE |
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W25Q64JVSTIM | Winbond Electronics | 5000 | 0.00 |
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IC FLASH 64MBIT SPI 8VSOP |
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MT53D768M64D8JS-053 WT ES:D TR | Micron Technology Inc. | 5000 | 0.00 |
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IC DRAM 48GBIT 1866MHZ 366VFBGA |
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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