Customized PCBs & Electronic Components — All in One Place
| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
|---|---|---|---|---|---|---|---|
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IS29GL128S-10DHV01-TR | Cypress Semiconductor Corp | 5000 | 0.00 |
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IC FLASH 128MBIT PARALLEL 64FBGA |
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W25Q64CVZEJG TR | Winbond Electronics | 5000 | 0.00 |
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IC FLASH 64MBIT SPI/QUAD 8WSON |
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93C76C/WF15K | Microchip Technology | 5000 | 0.00 |
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IC EEPROM 8KBIT SPI 3MHZ DIE |
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MT52L512M64D4PQ-107 WT:B | Micron Technology Inc. | 5000 | 0.00 |
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IC DRAM 32GBIT 933MHZ 253VFBGA |
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MT52L256M64D2PP-093 WT:B TR | Micron Technology Inc. | 5000 | 0.00 |
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IC DRAM 16GBIT 1067MHZ 253VFBGA |
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W25Q256FVFIP | Winbond Electronics | 5000 | 0.00 |
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IC FLASH 256MBIT SPI/QUAD 16SOIC |
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MT53B128M32D1DS-062 AAT:A | Micron Technology Inc. | 5000 | 0.00 |
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IC DRAM 4GBIT 1600MHZ 200WFBGA |
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IS29GL128S-10DHV02 | Cypress Semiconductor Corp | 5000 | 0.00 |
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IC FLASH 128MBIT PARALLEL 64FBGA |
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W25Q64CVZEJP TR | Winbond Electronics | 5000 | 0.00 |
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IC FLASH 64MBIT SPI/QUAD 8WSON |
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TC58CVG0S3HRAIG | Kioxia America, Inc. | 5000 | 0.00 |
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IC FLASH 1GBIT SPI 104MHZ 8WSON |
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MT53B192M32D1Z0AMWC1 TR | Micron Technology Inc. | 5000 | 0.00 |
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IC SDRAM 6GBIT DIE |
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MT29F4G08ABBEAM70M3WC1 | Micron Technology Inc. | 5000 | 0.00 |
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IC FLASH 4GBIT PARALLEL WAFER |
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MT53B128M32D1NP-062 AAT:A | Micron Technology Inc. | 5000 | 0.00 |
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IC DRAM 4GBIT 1600MHZ 200WFBGA |
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IS29GL128S-10DHV02-TR | Cypress Semiconductor Corp | 5000 | 0.00 |
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IC FLASH 128MBIT PARALLEL 64FBGA |
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W25Q64CVZPJG TR | Winbond Electronics | 5000 | 0.00 |
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IC FLASH 64MBIT SPI/QUAD 8WSON |
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TC58CVG2S0HRAIG | Kioxia America, Inc. | 5000 | 0.00 |
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IC FLASH 4GBIT SPI 104MHZ 8WSON |
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MT53B256M64D2NH-062 WT:B TR | Micron Technology Inc. | 5000 | 0.00 |
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IC DRAM 16GBIT 1600MHZ FBGA |
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93C86C-I/S15K | Microchip Technology | 5000 | 0.00 |
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IC EEPROM 16KBIT SPI 3MHZ DIE |
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MT29F8G08ABBCAH4-IT:C | Micron Technology Inc. | 5000 | 0.00 |
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IC FLASH 8GBIT PARALLEL 63VFBGA |
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MT29F8G01ADAFD12-AATES:F | Micron Technology Inc. | 5000 | 0.00 |
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IC FLASH 8GBIT SPI 24TPBGA |
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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