Customized PCBs & Electronic Components — All in One Place
Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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5390317-4 | TE Connectivity AMP Connectors | 5000 | - |
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CONN GUIDE ASSY FOR GBIC CONN |
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6658106-2 | TE Connectivity AMP Connectors | 5000 | - |
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CONN GUIDE ASSY FOR GBIC CONN |
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RPBH-019-01 | Samtec Inc. | 5000 | - |
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CAGE FOR RCH/ERI8 SERIES, EYE SP |
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0747200502 | Molex | 5000 | - |
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CONN ADPT LOOPBACK FOR SFP CONN |
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1065018004 | Molex | 5000 | - |
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SEALED SFP ADAPTER BLACK DC |
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0747630015 | Molex | 5000 | - |
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CONN ADPT LOOPBACK FOR QSFP CONN |
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0747630040 | Molex | 5000 | - |
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CONN ADP LOOPBACK FOR QSFP+ CONN |
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0747630045 | Molex | 5000 | - |
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CONN ADP LOOPBACK FOR QSFP+ CONN |
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2110903-1 | TE Connectivity AMP Connectors | 5000 | - |
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CONN HEATSINK FOR CFP GUIDE RAIL |
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0747630035 | Molex | 5000 | - |
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CONN ADP LOOPBACK FOR QSFP+ CONN |
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2110915-1 | WEC | 5000 | - |
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CONN HARDWARE KIT FOR CFP CONN |
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1489948-2 | TE Connectivity AMP Connectors | 5000 | - |
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CONN CLIPS FOR XFP HEAT SINKS |
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2110743-1 | TE Connectivity AMP Connectors | 5000 | - |
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CONN LIGHT PIPE FOR SFP+ CAGE |
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SF-QSFPLOOPBK-002 | Amphenol Cables on Demand | 5000 | - |
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CONN ADPT LOOPBACK FOR QSFP CONN |
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GT17HSK-4S-HU | Hirose Electric Co Ltd | 5000 | - |
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CONN HSG FOR GT17 SERIES |
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GT17HNN-4DS-R | Hirose Electric Co Ltd | 5000 | - |
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CONN RETAINER FOR GT17 HSG |
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FX15S-31P-C | Hirose Electric Co Ltd | 5000 | - |
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CONN HSG FOR FX15 SERIES |
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2288221-3 | TE Connectivity AMP Connectors | 5000 | - |
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CONN DUST CAP FOR CFP2 RCPT |
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2288231-3 | TE Connectivity AMP Connectors | 5000 | - |
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CONN HEATSINK CLIP FOR CFP4 CAGE |
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2289501-3 | TE Connectivity AMP Connectors | 5000 | - |
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CONN HEAT SINK FOR CFP4 CAGES |
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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