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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
|---|---|---|---|---|---|---|---|
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INN3167C-H107-TL | Power Integrations | 5000 | 1.28 |
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IC OFFLINE SW MULT TOP 24INSOP |
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MIC3808BM-TR | Microchip Technology | 5000 | 0.00 |
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IC OFFLINE SW PUSH-PULL 8SOIC |
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TNY266G | Power Integrations | 5000 | 0.00 |
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IC OFFLINE SWITCH FLYBACK 8SMD |
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ICE2B765I | Infineon Technologies | 5000 | 0.00 |
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IC OFFLINE SWITCH FLYBACK TO220 |
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FSQ0465RUWDTU | onsemi | 5000 | 0.00 |
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IC OFFLINE SW FLBACK TO220F-6L |
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TNY274PNAU | Power Integrations | 5000 | 0.00 |
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IC OFFLINE SWITCH FLYBACK 8DIP |
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INN3167C-H109-TL | Power Integrations | 5000 | 1.28 |
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IC OFFLINE SW MULT TOP 24INSOP |
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MIC3838BMM | Microchip Technology | 5000 | 0.00 |
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IC OFFLINE SW PUSH-PULL 10MSOP |
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TNY266G-TL | Power Integrations | 5000 | 0.00 |
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IC OFFLINE SWITCH FLYBACK 8SMD |
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ICE2B765P2BKSA1 | Infineon Technologies | 5000 | 0.00 |
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IC OFFLINE SW FLYBACK TO220-6 |
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ICE3A1065LJHKLA1 | Infineon Technologies | 5000 | 0.00 |
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IC OFFLINE SWITCH FLYBACK 8DIP |
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TNY276PNAU | Power Integrations | 5000 | 0.00 |
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IC OFFLINE SWITCH FLYBACK 8DIP |
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INN3167C-H101-TL | Power Integrations | 5000 | 1.28 |
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IC OFFLINE SW MULT TOP 24INSOP |
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MIC3838BMM-TR | Microchip Technology | 5000 | 0.00 |
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IC OFFLINE SW PUSH-PULL 10MSOP |
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TNY266P | Power Integrations | 5000 | 0.00 |
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IC OFFLINE SWITCH FLYBACK 8DIP |
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ICE2BS01G | Infineon Technologies | 5000 | 0.00 |
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IC OFFLINE SWITCH FLYBACK 8DSO |
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TNY279PNAU | Power Integrations | 5000 | 0.00 |
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IC OFFLINE SWITCH FLYBACK 8DIP |
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NCP1076BAP100G | onsemi | 5000 | 1.60 |
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IC OFFLINE SWITCH FLYBACK 8DIP |
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MIC38C42-1BM | Microchip Technology | 5000 | 0.00 |
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IC OFFLINE SW MULT TOP 14SOIC |
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TNY267G | Power Integrations | 5000 | 0.00 |
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IC OFFLINE SWITCH FLYBACK 8SMD |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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