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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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LP3971SQX-7848/NOPB | Texas Instruments | 5000 | 0.00 |
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IC PMU FOR APP PROCESSOR 40WQFN |
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MWCT1213VLL | NXP USA Inc. | 5000 | 10.01 |
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32BIT 256K FLASH |
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O9039A389IZWSRQ1 | Texas Instruments | 5000 | 12.87 |
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PMU FOR PROCESSOR |
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MAX17613CATP+ | Analog Devices Inc./Maxim Integrated | 5000 | 3.82 |
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IC CURRENT LIMIT OV, UV, RP 20TQ |
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MAX17108ETI+ | Analog Devices Inc./Maxim Integrated | 5000 | 3.97 |
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IC LEVEL SHIFTER 10CH 28TQFN |
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MWCT1200CFM | NXP USA Inc. | 5000 | 4.00 |
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IC MULTI COIL 5W 5V 32QFN |
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NCP392ARFCCT1G | onsemi | 5000 | 0.80 |
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IC OVP FRONT END CTLR 100V 12CSP |
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MC33FS6502LAER2 | NXP USA Inc. | 5000 | 10.17 |
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SYSTEM BASIS CHIP DCDC 0.8A VCO |
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MAX4807CTN+ | Analog Devices Inc./Maxim Integrated | 5000 | 12.98 |
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IC DGTL PULSER DUAL 56TQFN |
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LT3484EDCB-0#TRPBF | Analog Devices Inc. | 5000 | 3.83 |
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IC PHOTOFLASH CAP CHARGER 6-DFN |
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BD81842MUV-ME2 | Rohm Semiconductor | 5000 | 4.13 |
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AUTOMOTIVE PANEL POWER MANAGEMEN |
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MWPR1516CALR | NXP USA Inc. | 5000 | 4.00 |
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IC RECEIVER 16KB FLASH 32QFN |
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NCP392DRFCCT1G | onsemi | 5000 | 0.44 |
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IC OVP FRONTEND PROTECTION 12CSP |
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MC33FS6503NAER2 | NXP USA Inc. | 5000 | 10.17 |
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SYSTEM BASIS CHIP DCDC 0.8A VCO |
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HV748K6-G | Microchip Technology | 5000 | 13.19 |
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IC ULTRASOUND PULSER |
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LT3484EDCB-1#TRPBF | Analog Devices Inc. | 5000 | 3.83 |
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IC PHOTOFLASH CAP CHARGER 6-DFN |
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BQ51222YFPR | Texas Instruments | 5000 | 4.14 |
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IC WIRELESS PWR RCVR 42DSBGA |
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MC34903CP5EK | Rochester Electronics, LLC | 5000 | 4.10 |
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SYSTEM BASIS CHIP, 2X 5.0 V/400M |
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MAX16126TCB+T | Analog Devices Inc./Maxim Integrated | 5000 | 0.00 |
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IC LOAD DUMP REV V PROT 12TQFN |
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MC33FS6503NAE | NXP USA Inc. | 5000 | 10.17 |
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SYSTEM BASIS CHIP DCDC 0.8A VCO |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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