Customized PCBs & Electronic Components — All in One Place
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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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APA501-80-006 | Artesyn Embedded Power | 5000 | - |
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HEATSINK (80) 115X59X37MM HORZ |
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21543 | Vicor Corporation | 5000 | - |
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INMATE MAXI OUT XL BOB |
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F4810-RG | Bel Power Solutions | 5000 | - |
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DC-DC CONV INP FILTER |
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30089 | Vicor Corporation | 5000 | - |
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HEATSINK VI-200 HORIZ. 0.9" |
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30269 | Vicor Corporation | 5000 | - |
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HEAT SINK MINI 0.9" THRD/TRANS |
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30724 | Vicor Corporation | 5000 | - |
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HEATSINK MINI 0.9" THRU/TRANS |
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HALF12T | TDK-Lambda Americas Inc | 5000 | - |
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HEATSINK PFE500F WIDTH 1.38" FIN |
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HAMF10T | TDK-Lambda Americas Inc | 5000 | - |
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HEATSINK PFE1000F |
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20267 | Vicor Corporation | 5000 | - |
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THERMMATE VI-J00 1=10PCS |
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URAM3C21 | Vicor Corporation | 5000 | - |
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URAM OUTPUT ATTENUATION MODULE |
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18365 | Vicor Corporation | 5000 | - |
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SOCKET KIT |
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VI-AIM-C1 | Vicor Corporation | 5000 | - |
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FRONT END MODULE 9 PIN HALF BRIC |
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32497 | Vicor Corporation | 5000 | - |
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DIFFERENTIAL OUTPUT INDUCTOR |
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31943 | Vicor Corporation | 5000 | - |
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INDUCTOR COMMON MODE INPUT |
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TEN-HS3 | Traco Power | 5000 | - |
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HEAT SINK FOR TEN40/40WI/60 PWR |
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32173 | Vicor Corporation | 5000 | - |
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HEATSINK MICRO 0.4" THRD/TRANS |
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30771 | Vicor Corporation | 5000 | - |
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HEATSINK VI-J00 TRANSVERSE 0.9" |
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32783 | Vicor Corporation | 5000 | - |
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HALF 11MM LONGITUDINAL FLOW PINS |
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HAF10L | TDK-Lambda Americas Inc | 5000 | - |
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HEATSINK FULL BRICK 1" FINS |
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23485R | Vicor Corporation | 5000 | - |
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CONNECTOR KIT |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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