Customized PCBs & Electronic Components — All in One Place
Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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URAM2H21 | Vicor Corporation | 5000 | - |
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URAM "H" 20A LP SLOT |
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43809-10 | Vicor Corporation | 5000 | - |
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HEAT SINK FOR DCDC CNVTR/ARRAYS |
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URAM2H22 | Vicor Corporation | 5000 | - |
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URAM OUTPUT ATTENUATION MODULE |
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16385 | Vicor Corporation | 5000 | - |
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FLATPAC OUTPUT CONNECTOR |
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VE-RAM-E2 | Vicor Corporation | 5000 | - |
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RAM RIPPLE ATTENUATOR MODULE |
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PAL02-2 | TDK-Lambda Americas Inc | 5000 | - |
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COMMON MODE CHOKE |
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21510 | Vicor Corporation | 5000 | - |
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INMATE SET, 900, BOB, XLL |
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PAL03-1 | TDK-Lambda Americas Inc | 5000 | - |
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COMMON MODE CHOKE |
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URAM3H11 | Vicor Corporation | 5000 | - |
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URAM "H" 30A SP SLOT |
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PAL05-1 | TDK-Lambda Americas Inc | 5000 | - |
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COMMON MODE CHOKE |
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URAM2H11 | Vicor Corporation | 5000 | - |
Add To CartInquiry Now |
URAM "H" 20A SP SLOT |
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PAL10-1 | TDK-Lambda Americas Inc | 5000 | - |
Add To CartInquiry Now |
COMMON MODE CHOKE |
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URAM2H23 | Vicor Corporation | 5000 | - |
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OUTPUT RIPPLE ATTENUATION MODULE |
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PAH146L12 | TDK-Lambda Americas Inc | 5000 | - |
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HEATSINK THERMAL PAD KIT FOR DC/ |
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URAM3H23 | Vicor Corporation | 5000 | - |
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URAM "H" 30A LP THRU |
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PAH146L23 | TDK-Lambda Americas Inc | 5000 | - |
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HEATSINK THERMAL PAD KIT FOR DC/ |
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URAM2H12 | Vicor Corporation | 5000 | - |
Add To CartInquiry Now |
URAM "H" 20A SP THRD |
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PAH146W12 | TDK-Lambda Americas Inc | 5000 | - |
Add To CartInquiry Now |
HEATSINK THERMAL PAD KIT FOR DC/ |
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URAM2HS1 | Vicor Corporation | 5000 | - |
Add To CartInquiry Now |
URAM "H" 20A SPG SLOT |
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PAH146W23 | TDK-Lambda Americas Inc | 5000 | - |
Add To CartInquiry Now |
HEATSINK THERMAL PAD KIT FOR DC/ |
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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