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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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EN1CN2 | Vicor Corporation | 5000 | - |
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ENMOD "C" 600W LPG THRD |
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VI-RAM-I1 | Vicor Corporation | 5000 | - |
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RIPPLE ATTENUATOR MODULE |
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M-FIAM7BH23 | Vicor Corporation | 5000 | - |
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FIAM7B "H" M28 24A LP THRU |
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30096 | Vicor Corporation | 5000 | - |
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HTSK LP; 3.40W X 4.60LG (MAXI) |
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FIAM110EN1 | Vicor Corporation | 5000 | - |
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FIAM "E" 110V 8.5A LGP SLOT |
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VI-A11-IU | Vicor Corporation | 5000 | - |
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VI-A11-IU 24V 200W IAM |
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M-FIAM7BH22 | Vicor Corporation | 5000 | - |
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FIAM7B "H" M28 24A LP THRD |
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30270 | Vicor Corporation | 5000 | - |
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HEATSINK |
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VI-A11-EU | Vicor Corporation | 5000 | - |
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VI-A11-EU 24V/200W IAM |
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VE-A11-IU | Vicor Corporation | 5000 | - |
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VE-A11-IU 24V 200W IAM |
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M-FIAM9HK1 | Vicor Corporation | 5000 | - |
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FIAM9 "H" M28 18A XPG SLOT ROH |
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30780 | Vicor Corporation | 5000 | - |
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HEATSINK EXTRUSION |
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VI-AWW-CU-F1 | Vicor Corporation | 5000 | - |
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VI-AWW-CU-F1 24V/200W IAM FIN |
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VI-AWW-IU | Vicor Corporation | 5000 | - |
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VI-AWW-IU 24V/200W IAM |
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TPM1714BE3MG5K7C08 | Vicor Corporation | 5000 | - |
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THREE PHASE MODULE, 1714 VIA, PC |
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30123 | Vicor Corporation | 5000 | - |
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.9H CUSTOM HEAT SINK M3 MOUNT |
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VI-AIM-C1-B1 | Vicor Corporation | 5000 | - |
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VI-AIM-C1-B1 |
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VE-AIM-I1 | Vicor Corporation | 5000 | - |
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VE-AIM-I1 ROHS |
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M-FIAM3HN1 | Vicor Corporation | 5000 | - |
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FIAM "H" M270 3A LPG SLOT |
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30188 | Vicor Corporation | 5000 | - |
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HEAT SINK |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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