Customized PCBs & Electronic Components — All in One Place
| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
|---|---|---|---|---|---|---|---|
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0015045341 | Molex | 5000 | - |
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CONN CLIP INTERIM SNGL ROW 34POS |
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2-643077-7 | TE Connectivity AMP Connectors | 5000 | - |
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CONN COVER STRAIN RELIEF 27POS |
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QE-POL-POST | JAE Electronics | 5000 | - |
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POLARIZING POST |
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PMS-02V-S | JST Sales America Inc. | 5000 | - |
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2.0MM PITCH CONNECTOR |
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50-65-0108 | WEC | 5000 | - |
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CGRID SL PMC WTOW SR MODBRNCH 8C |
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WB-60SA | TE Connectivity Deutsch ICT Connectors | 5000 | - |
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WEDGE LOCK |
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MX2608C00111776 | JAE Electronics | 5000 | - |
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CONNECTOR |
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2321927-3 | TE Connectivity AMP Connectors | 5000 | - |
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TPA RCPT HSG SIGNAL DBL LCK 3P |
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0015045344 | Molex | 5000 | - |
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CONN CLIP INTERIM SNGL ROW 34POS |
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2-640550-5 | TE Connectivity AMP Connectors | 5000 | - |
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CONN DUST COVER 25POS MTA-100 |
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4-292249-2 | TE Connectivity AMP Connectors | 5000 | - |
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1.5 MINI CT LATTICE PLUG/KIT K |
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2018612101 | Molex | 5000 | - |
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MIZU-P38 WIRE SEAL (M) |
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89-00-2027 | WEC | 5000 | - |
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RANGE RCPT MNT CLIP |
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DF36AJ-50P-SHL | Hirose Electric Co Ltd | 5000 | - |
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CONN COVER FOR 50POS PLUG |
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MX2602C00101734 | JAE Electronics | 5000 | - |
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CONNECTOR |
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2093250004 | Molex | 5000 | - |
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TPA FOR L1NK 300 - 1X4 CKT |
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104584-1 | TE Connectivity AMP Connectors | 5000 | - |
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64 LEVEL V COVER .125 |
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2-643075-8 | TE Connectivity AMP Connectors | 5000 | - |
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CONN COVER STRAIN RELIEF 28POS |
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GT10B-20/10DS-HU | Hirose Electric Co Ltd | 5000 | - |
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CONN INLINE SOCKET HOUSING |
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5046950507 | Molex | 5000 | - |
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CP 3.3 W/W CONN. RETAINER BROWN |
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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