Customized PCBs & Electronic Components — All in One Place
| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
|---|---|---|---|---|---|---|---|
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42632-3 | TE Connectivity AMP Connectors | 5000 | - |
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CONN PIN 22-24AWG CRIMP GOLD |
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43030-0012 | WEC | 5000 | - |
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MICROFIT 3.0 F CRP TERM LSE 30AU |
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85861-2 | TE Connectivity AMP Connectors | 5000 | - |
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CONN SOCKET SOLDER PCB GOLD |
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282376-1 | TE Connectivity AMP Connectors | 5000 | - |
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070 SERIES REPT. CONTACT |
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0008701047 | Molex | 5000 | - |
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CONN SOCKET 22-28AWG CRIMP TIN |
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42634-3 | TE Connectivity AMP Connectors | 5000 | - |
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CONN PIN 18-20AWG CRIMP GOLD |
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172253-3023 | WEC | 5000 | - |
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ULTRA-FIT CRIMP TERM 16-18 TIN |
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85866-4 | TE Connectivity AMP Connectors | 5000 | - |
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CONN SOCKET SOLDER PCB GOLD |
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2201289-1 | TE Connectivity AMP Connectors | 5000 | - |
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1.0 SEALED RECEPTACLE CONTACT SS |
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0039000334 | Molex | 5000 | - |
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CONN SOCKET 18-24AWG CRIMP GOLD |
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66071-3 | TE Connectivity AMP Connectors | 5000 | - |
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CONN PIN 22-24AWG CRIMP GOLD |
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39-00-0168 | WEC | 5000 | - |
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MINIFIT TERM CRP FEM LSE BS AU 1 |
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0008700057 | Molex | 5000 | - |
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CONN SOCKET 22-28AWG CRIMP TIN |
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1564880-1 | TE Connectivity AMP Connectors | 5000 | - |
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GET 0.64,FEMALE TERMINAL 0.13M |
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0040014503 | Molex | 5000 | - |
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CONN TERMINAL .045 X .750 |
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967228-1 | TE Connectivity AMP Connectors | 5000 | - |
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TERM MAXI-POW-TIM GAP 0.8 |
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66074-1 | TE Connectivity AMP Connectors | 5000 | - |
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CONN PIN 22-24AWG CRIMP TIN-LEAD |
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50351-8100 | WEC | 5000 | - |
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2.5 W/B CRIMP RECEPTACLE |
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FI-XC3-1-15000 | JAE Electronics | 5000 | - |
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CONN BLADE 30-36AWG CRIMP GOLD |
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1241378-3 | TE Connectivity AMP Connectors | 5000 | - |
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CONN SOCKET 22-24AWG CRIMP |
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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