Customized PCBs & Electronic Components — All in One Place
| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
|---|---|---|---|---|---|---|---|
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DPER08 | Schneider Electric | 5000 | - |
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THERMAL OVERLOAD RELAY 2.5...4A |
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DPER05 | Schneider Electric | 5000 | - |
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THERMAL OVERLOAD RELAY 0.63...1A |
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DPER21 | Schneider Electric | 5000 | - |
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THERMAL OVERLOAD RELAY 12...18A |
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DPER04 | Schneider Electric | 5000 | - |
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THERMAL OVERLOAD RELAY 0.4...0.6 |
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DPER07 | Schneider Electric | 5000 | - |
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THERMAL OVERLOAD RELAY 1.6...2.5 |
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DPER03 | Schneider Electric | 5000 | - |
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THERMAL OVERLOAD RELAY 0.25...0. |
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DPER16 | Schneider Electric | 5000 | - |
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THERMAL OVERLOAD RELAY 9...13A |
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DPER32 | Schneider Electric | 5000 | - |
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THERMAL OVERLOAD RELAY 23...32A |
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DPER22 | Schneider Electric | 5000 | - |
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THERMAL OVERLOAD RELAY 16...24A |
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DRB-4 | R-K Electronics, Inc. | 5000 | - |
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DIN BRACKET, RCD, RCY, CSR & CSR |
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DRB-1 | R-K Electronics, Inc. | 5000 | - |
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DIN BRACKET, RCS, RDS & SP |
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M71 | TELE Controls Inc | 5000 | - |
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RELAY PROTECTION MODULE |
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HSP1 | Galco Industrial Electronics | 5000 | - |
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THERMAL PAD,1-PH SSR,NON-ADHESIV |
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DRB-2 | R-K Electronics, Inc. | 5000 | - |
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DIN BRACKET (2), M-SERIES, MCDR |
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EESX1866F | WEC | 5000 | - |
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PHOTO MICROSENSOR |
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HN10U | B&J-USA, Inc. | 5000 | - |
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AUX 1N/O EM SNAP-ON 10A UL 600V |
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DLHD-6 | R-K Electronics, Inc. | 5000 | - |
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ELASTIC HOLDDOWN STRAP |
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HN01U | B&J-USA, Inc. | 5000 | - |
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AUX 1N/C LB SNAP-ON 10A UL 600V |
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DRB-3 | R-K Electronics, Inc. | 5000 | - |
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DIN BRACKET (2), PVC, QPB, CUB & |
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HA01 | B&J-USA, Inc. | 5000 | - |
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AUX 1N/C SNAP-ON 16A UL 600V |
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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