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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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P6B-Y1 | Omron Electronics Inc-EMC Div | 5000 | - |
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REMOVAL TOOL FOR PCB RELAY |
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3RT29262PR01 | Siemens Industry, Inc. | 5000 | - |
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PNEUMATIC OFF DELY S0 0.1-30 SEC |
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RY16037 | TE Connectivity Potter & Brumfield Relays | 5000 | - |
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CLIP RETAINING PLASTIC |
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3RT29162BK01 | Siemens Industry, Inc. | 5000 | - |
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OFF DELAY DEVICE FOR UC 110V OPE |
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HS351DR | Sensata-Crydom | 5000 | - |
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HEATSINK SSR 3.5DEG C/W DIN MNT |
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3RT29162BL01 | Siemens Industry, Inc. | 5000 | - |
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OFF DELAY DEVICE FOR UC 230V OPE |
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HS271DR | Sensata-Crydom | 5000 | - |
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HEATSINK SSR 2.7DEG C/W DIN MNT |
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3RT29162BE01 | Siemens Industry, Inc. | 5000 | - |
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OFF DELAY DEVICE FOR DC 24V OPER |
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HS351 | Sensata-Crydom | 5000 | - |
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HEATSINK SSR 3.5DEG C/W PNL MNT |
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3RA1933-3E | Siemens Industry, Inc. | 5000 | - |
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CONTACTOR REV WIRE MOD BOTTOM FO |
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HS271 | Sensata-Crydom | 5000 | - |
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HEATSINK SSR 2.7DEG C/W PNL MNT |
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3RA1933-3D | Siemens Industry, Inc. | 5000 | - |
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CONTACTOR WIRING MOD,TOP,ASSMBLY |
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DRK2 | Sensata-Crydom | 5000 | - |
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DIN BRACKET KIT 22.5MM |
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6-1616171-7 | TE Connectivity Aerospace, Defense and Marine | 5000 | - |
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16272001=ROD, CORE |
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2-1437683-3 | TE Connectivity AMP Connectors | 5000 | - |
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CONN BAIL TIE DOWN RELAY |
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3RU21364GB1 | Siemens Industry, Inc. | 5000 | - |
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OVERLOAD S2 CL10 36-45A PANEL MO |
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2-1437683-5 | TE Connectivity AMP Connectors | 5000 | - |
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CONN BAIL TIE DOWN MINI |
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3RU21364GD1 | Siemens Industry, Inc. | 5000 | - |
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OVERLOAD S2 CL10 36-45A PANEL MO |
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MTML0730 | TE Connectivity Potter & Brumfield Relays | 5000 | - |
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LED MODULE RED 110-230VAC |
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6-1616255-8 | TE Connectivity Aerospace, Defense and Marine | 5000 | - |
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34549010=SHIELD-TERMINAL TOP |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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