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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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ATA555814-DBB | Microchip Technology | 5000 | - |
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IC IDIC 1KB R/W 210PF DIE |
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ATA555814C-DBB | Microchip Technology | 5000 | - |
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IC IDIC 1KBIT R/W SAWN WAFER |
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SL13A-AQFT | ams | 5000 | - |
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HF/NFC SENSORY TAG IC |
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ATA5575M1330-DBN | Microchip Technology | 5000 | - |
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IC RFID 128BIT 330PF WAFER |
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ATA5276M-PGPW 19 | Microchip Technology | 5000 | - |
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IC XMITTER 125KHZ FOR TPM 20QFN |
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ATA555812C-DDB | Microchip Technology | 5000 | - |
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IC IDIC 1KBIT R/W DIE |
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SL2MOS5401EV,118 | NXP USA Inc. | 5000 | - |
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IC I.CODE SLI-S PLLMC |
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M24LR64-RMB6T/2 | STMicroelectronics | 5000 | - |
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NFC/RFID 64KBIT EEPROM 13.56MHZ |
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MFRC52301HN1,157 | NXP USA Inc. | 5000 | - |
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IC READER 13.56MHZ 32-HVQFN |
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ATA555811C-DDB | Microchip Technology | 5000 | - |
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IC IDIC 1KBIT R/W DIE |
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ATA555811C-DBB | Microchip Technology | 5000 | - |
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IC IDIC 1KBIT R/W SAWN WAFER |
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ATA555812C-DBB | Microchip Technology | 5000 | - |
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IC IDIC 1KBIT R/W SAWN WAFER |
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ATA5577M2250C-DBN | Microchip Technology | 5000 | - |
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IC RFID R/W BUMP WAFER |
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ATA5577M1330C-DDT | Microchip Technology | 5000 | - |
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IC RFID R/W 125KHZ DIE WAFFLE PK |
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ATA555815C-PP | Microchip Technology | 5000 | - |
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IC IDIC PLASTIC TRANSPONDER |
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ATA555814C-DDB | Microchip Technology | 5000 | - |
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IC IDIC 1KBIT R/W DIE |
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ATA5577M1250C-DDT | Microchip Technology | 5000 | - |
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IC RFID R/W 125KHZ DIE WAFFLE PK |
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ATA5577M2330C-DBN | Microchip Technology | 5000 | - |
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IC RFID R/W BUMP WAFER |
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SL3S1001FTT,118 | NXP USA Inc. | 5000 | - |
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IC UCODE EPC G2 8TSSOP |
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MF1MOA2S50/D/3,118 | NXP USA Inc. | 5000 | - |
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IC MIFARE ULTRALIGHT PLLMC |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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