Customized PCBs & Electronic Components — All in One Place
| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
|---|---|---|---|---|---|---|---|
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HMC-C073 | Analog Devices Inc. | 5000 | - |
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WBAND VCO W/BUFFER AMPMODUL 38.4 |
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HMC7885FH18 | Analog Devices Inc. | 5000 | - |
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2 TO 6 GHZ 50 W HERMETIC FLANGED |
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UA0L30VM | Microsemi Corporation | 5000 | - |
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MODULE AMPLIFIER - 0.0001-30GHZ, |
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HMC7748 | Analog Devices Inc. | 5000 | - |
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2 TO 6 GHZ 25 W MODULE |
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HMC-C037 | Analog Devices Inc. | 5000 | - |
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WBAND AMP MOD |
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HMC-C078 | Analog Devices Inc. | 5000 | - |
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ULTRALO PHASENOISE AMP MODULE 1. |
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UA0L65VM | Microsemi Corporation | 5000 | - |
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MODULE AMPLIFIER - 0.0001-65GHZ, |
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UA2V50LM-E | Microsemi Corporation | 5000 | - |
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MMIC AMPLIFIER MODULE |
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UA2V50HM | Microsemi Corporation | 5000 | - |
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MODULE AMPLIFIER - 2-50GHZ, 22-3 |
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UA2V50LM | Microsemi Corporation | 5000 | - |
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MODULE AMPLIFIER - 2-50GHZ, 22-3 |
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UA2V50HM-E | Microsemi Corporation | 5000 | - |
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AMPLIFIER MODULE EVALUATION KIT |
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BGAC600A11E6327XTSA1 | Infineon Technologies | 5000 | - |
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IC MMIC RF CONTROLLER TSLP |
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BGA231N7E6330XTSA1 | Infineon Technologies | 5000 | - |
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IC AMP LNA SIGE GPS TSLP-7 |
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UA0U50HM | Microsemi Corporation | 5000 | - |
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MODULE AMPLIFIER - 0.01-50GHZ, 2 |
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BGA6H1BN6E6327XTSA1 | Infineon Technologies | 5000 | - |
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IC AMP MMIC TSNP-6 |
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BGA524N6E6327XTSA1 | Infineon Technologies | 5000 | - |
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IC AMP SI-MMIC |
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BGM7LLHM4L12E6327XTSA1 | Infineon Technologies | 5000 | - |
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IC AMP MMIC 12ATSLP |
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BGA729N6E6327XTSA1 | Infineon Technologies | 5000 | - |
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IC AMP MMIC 6TSNP |
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BGA713N7E6327XTSA1 | Infineon Technologies | 5000 | - |
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IC AMP LNA MMIC SGL-BAND TSLP-7 |
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BGA6L1BN6E6327XTSA1 | Infineon Technologies | 5000 | - |
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IC AMP MMIC TSNP-6 |
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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