Customized PCBs & Electronic Components — All in One Place
Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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ETC1-1T-5TR | M/A-Com Technology Solutions | 5000 | - |
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RF TRANSFORMER 1:1 5TERM. SMD |
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BALF-112X-02D3 | STMicroelectronics | 5000 | - |
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BALUN 431-436MHZ 8UFBGA |
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HHM1731F1 | TDK Corporation | 5000 | - |
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BALUN RF 1.71-1.88GHZ DCS |
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RFBLN1608050AM8T62 | Walsin Technology Corporation | 5000 | - |
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BALUN RF 2.4-2.5GHZ 1608 |
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HHM1506 | TDK Corporation | 5000 | - |
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XFRMR BALUN RF WCDMA SMD |
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BLN1608LL00R2400A | Yageo | 5000 | - |
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BALUN 2.45G 1.6X0.8X0.6 MM |
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RFBLN2012090BM5T25 | Walsin Technology Corporation | 5000 | - |
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BALUN RF CERAMIC GSM/DCS/PCS |
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BALF-2690-02D3 | STMicroelectronics | 5000 | - |
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IC BALUN FOR STLC2690 4FLIPCHIP |
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TTB08G51-350-2P-T20 | TDK Corporation | 5000 | - |
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XFRMR BALUN RF |
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TTB12G51-900-2P-T20 | TDK Corporation | 5000 | - |
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XFRMR BALUN RF |
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ATB2012-75011-TL000 | TDK Corporation | 5000 | - |
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XFRMR BALUN RF SMD |
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TTB16G11-201-4P | TDK Corporation | 5000 | - |
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XFRMR BALUN RF 174MHZ-860MHZ SMD |
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TTB16G11-900-4P-T20 | TDK Corporation | 5000 | - |
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XFRMR BALUN RF |
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TTB16G11-201-4P-T20 | TDK Corporation | 5000 | - |
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XFRMR BALUN RF |
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TTB16G11-900-4P | TDK Corporation | 5000 | - |
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XFRMR BALUN RF 174MHZ-860MHZ SMD |
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BLF2012LM37R2400A | Yageo | 5000 | - |
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COMBO 2.45G 2.0X1.2X0.8 MM |
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ATB2012E-75011M-T01 | TDK Corporation | 5000 | - |
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WOUND CHIP BALUN |
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DXP18BN5016DL | Murata Electronics North America | 5000 | - |
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COUPLER FILM |
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MABA-011015 | M/A-Com Technology Solutions | 5000 | - |
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TRANSFORMER 1:2.78 45-1200MHZ |
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MABA-009210-CT1760 | M/A-Com Technology Solutions | 5000 | - |
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TRANSFORMER 1:1 TXLINE |
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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