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| Datasheet | Image | Part Number | Manufacturers | Stock | Pricing(USD) | Quantity | Description |
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4620 | Keystone Electronics | 5000 | - |
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CONN TRANSIST TO-3 3POS TIN |
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42-3554-16 | Aries Electronics | 5000 | - |
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CONN IC DIP SOCKET ZIF 42POS |
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164-PRS21013-12 | Aries Electronics | 5000 | - |
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CONN SOCKET PGA ZIF GOLD |
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2-382467-3 | WEC | 5000 | - |
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CONN IC DIP SOCKET 28POS TIN |
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400-040-050 | 3M | 5000 | - |
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CONN IC DIP SOCKET 40POS GOLD |
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558-10-480M29-001104 | Preci-Dip | 5000 | - |
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BGA SURFACE MOUNT 1.27MM |
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168-PRS17011-12 | Aries Electronics | 5000 | - |
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CONN SOCKET PGA ZIF GOLD |
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1437540-5 | WEC | 5000 | - |
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CONN IC DIP SOCKET 32POS TINLEAD |
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42-6554-16 | Aries Electronics | 5000 | - |
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CONN IC DIP SOCKET ZIF 42POS |
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244-5205-00 | 3M | 5000 | - |
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3M TEXTOOL OPEN-TOP SOCKETS FOR |
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2-382470-3 | WEC | 5000 | - |
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CONN IC DIP SOCKET 32POS TIN |
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500-032-050 | 3M | 5000 | - |
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CONN SOCKET SIP 32POS GOLD |
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510-13-241-18-075001 | Mill-Max Manufacturing Corp. | 5000 | - |
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SKT PGA SOLDRTL |
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172-PLS16002-12 | Aries Electronics | 5000 | - |
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CONN SOCKET PGA ZIF GOLD |
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1-1814655-7 | TE Connectivity AMP Connectors | 5000 | - |
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CONN SOCKET SIP 28POS GOLD |
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0475939000 | Molex | 5000 | - |
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CONN SOCKET LGA 1366POS NICKEL |
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175-PGM16003-11 | Aries Electronics | 5000 | - |
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CONN SOCKET PGA GOLD |
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28-3574-18 | Aries Electronics | 5000 | - |
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CONN IC DIP SOCKET ZIF 28POS GLD |
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2-382568-0 | TE Connectivity AMP Connectors | 5000 | - |
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CONN IC DIP SOCKET 20POS TIN |
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MS03 | Apex Microtechnology | 5000 | - |
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CONN TRANSIST TO-3 8POS GOLD |
Frequently Asked Questions
What is a LEMO GMA.0B.040.DR connector and what is it used for?
The LEMO GMA.0B.040.DR is a specific model of push-pull self-latching connector. It is commonly used in medical, industrial control, test and measurement, and audio/video applications due to its reliable and robust design, compact size, and high durability.
What is the purpose of an evaluation board (EVAL board)?
An evaluation board, or EVM, is a printed circuit board designed to help engineers and developers test and evaluate the functionality of a specific semiconductor chip or integrated circuit (IC) before integrating it into a final product. It speeds up the development process and simplifies prototyping.
What is the difference between an evaluation module and an evaluation kit?
An evaluation module (EVM) typically refers to a single board for a specific component. An evaluation kit (EVK) usually includes the evaluation module plus additional accessories, software, cables, or documentation to provide a more complete development environment.
How do I choose the right integrated circuit (IC) for my project?
Choosing the right IC depends on several factors, including the specific function you need (e.g., amplification, data conversion), technical specifications (e.g., voltage, power consumption), package type, and cost. It's best to consult the datasheet and consider your project's constraints and requirements.
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